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    Damage Mechanics of Surface Mount Technology Solder Joints Under Concurrent Thermal and Dynamic Loading

    Source: Journal of Electronic Packaging:;1999:;volume( 121 ):;issue: 002::page 61
    Author:
    R. Chandaroy
    ,
    C. Basaran
    DOI: 10.1115/1.2792669
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In the electronic industry, the dominant failure mode for solder joints is assumed to be thermal cycling. When semiconductor devices are used in vibrating environment, such as automotive and military applications, dynamic stresses contribute to the failure mechanism of the solder joint, and can become the dominant failure mode. In this paper, a damage mechanics based unified constitutive model for Pb40/Sn60 solder joints has been developed to accurately predict the thermomechanical behavior of solder joints under concurrent thermal and dynamic loading. It is shown that simultaneous application of thermal and dynamic loads significantly shorten the fatigue life. Hence, damage induced in the solder joint by the vibrations have to be included, in fatigue life predictions to correctly predict the reliability of solder joints. The common practice of relating only thermal cycling induced inelastic strain to fatigue life can be inadequate to predict solder joint reliability. A series of parametric studies were conducted to show that contrary to popular opinion all dynamic loading induced strains are not elastic. Hence, vibrations can significantly affect the fatigue life and reliability of solder joints in spite of their small mass.
    keyword(s): Dynamic testing (Materials) , Solder joints , Surface mount technology , Fatigue life , Reliability , Stress , Vibration , Failure , Semiconductors (Materials) , Defense industry , Constitutive equations AND Failure mechanisms ,
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      Damage Mechanics of Surface Mount Technology Solder Joints Under Concurrent Thermal and Dynamic Loading

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/122007
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    • Journal of Electronic Packaging

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    contributor authorR. Chandaroy
    contributor authorC. Basaran
    date accessioned2017-05-08T23:59:22Z
    date available2017-05-08T23:59:22Z
    date copyrightJune, 1999
    date issued1999
    identifier issn1528-9044
    identifier otherJEPAE4-26173#61_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/122007
    description abstractIn the electronic industry, the dominant failure mode for solder joints is assumed to be thermal cycling. When semiconductor devices are used in vibrating environment, such as automotive and military applications, dynamic stresses contribute to the failure mechanism of the solder joint, and can become the dominant failure mode. In this paper, a damage mechanics based unified constitutive model for Pb40/Sn60 solder joints has been developed to accurately predict the thermomechanical behavior of solder joints under concurrent thermal and dynamic loading. It is shown that simultaneous application of thermal and dynamic loads significantly shorten the fatigue life. Hence, damage induced in the solder joint by the vibrations have to be included, in fatigue life predictions to correctly predict the reliability of solder joints. The common practice of relating only thermal cycling induced inelastic strain to fatigue life can be inadequate to predict solder joint reliability. A series of parametric studies were conducted to show that contrary to popular opinion all dynamic loading induced strains are not elastic. Hence, vibrations can significantly affect the fatigue life and reliability of solder joints in spite of their small mass.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleDamage Mechanics of Surface Mount Technology Solder Joints Under Concurrent Thermal and Dynamic Loading
    typeJournal Paper
    journal volume121
    journal issue2
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2792669
    journal fristpage61
    journal lastpage68
    identifier eissn1043-7398
    keywordsDynamic testing (Materials)
    keywordsSolder joints
    keywordsSurface mount technology
    keywordsFatigue life
    keywordsReliability
    keywordsStress
    keywordsVibration
    keywordsFailure
    keywordsSemiconductors (Materials)
    keywordsDefense industry
    keywordsConstitutive equations AND Failure mechanisms
    treeJournal of Electronic Packaging:;1999:;volume( 121 ):;issue: 002
    contenttypeFulltext
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