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    Axisymmetric Peeling of Thin Elastic Films: A Perturbation Solution

    Source: Journal of Applied Mechanics:;2023:;volume( 090 ):;issue: 010::page 101011-1
    Author:
    Chen, Erteng
    ,
    Dai, Zhaohe
    DOI: 10.1115/1.4062831
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: We study the mechanical behavior of a thin elastic film that is affixed to a rigid substrate and subjected to a transverse force using a shaft with a finite radius. This scenario, also referred to as axisymmetric peeling, is encountered frequently in conventional blister tests as well as in our daily lives when removing an adhesive film from a substrate. Our primary objective is to gain a quantitative understanding of how the shaft’s radius influences the relationships between force and displacement, as well as between force and delamination areas. These relationships can serve as a dependable method to determine both the film’s elastic modulus and the adhesion strength between the film and its substrate. In this work, we provide a simple perturbation solution to this geometrically nonlinear problem while avoiding any use of ad hoc assumptions that were previously required. As a result, our results are in excellent agreement with numerical simulations and offer improved accuracy compared to analytical solutions available in the literature.
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      Axisymmetric Peeling of Thin Elastic Films: A Perturbation Solution

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    http://yetl.yabesh.ir/yetl1/handle/yetl/4294407
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    contributor authorChen, Erteng
    contributor authorDai, Zhaohe
    date accessioned2023-11-29T18:50:23Z
    date available2023-11-29T18:50:23Z
    date copyright7/18/2023 12:00:00 AM
    date issued7/18/2023 12:00:00 AM
    date issued2023-07-18
    identifier issn0021-8936
    identifier otherjam_90_10_101011.pdf
    identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4294407
    description abstractWe study the mechanical behavior of a thin elastic film that is affixed to a rigid substrate and subjected to a transverse force using a shaft with a finite radius. This scenario, also referred to as axisymmetric peeling, is encountered frequently in conventional blister tests as well as in our daily lives when removing an adhesive film from a substrate. Our primary objective is to gain a quantitative understanding of how the shaft’s radius influences the relationships between force and displacement, as well as between force and delamination areas. These relationships can serve as a dependable method to determine both the film’s elastic modulus and the adhesion strength between the film and its substrate. In this work, we provide a simple perturbation solution to this geometrically nonlinear problem while avoiding any use of ad hoc assumptions that were previously required. As a result, our results are in excellent agreement with numerical simulations and offer improved accuracy compared to analytical solutions available in the literature.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleAxisymmetric Peeling of Thin Elastic Films: A Perturbation Solution
    typeJournal Paper
    journal volume90
    journal issue10
    journal titleJournal of Applied Mechanics
    identifier doi10.1115/1.4062831
    journal fristpage101011-1
    journal lastpage101011-9
    page9
    treeJournal of Applied Mechanics:;2023:;volume( 090 ):;issue: 010
    contenttypeFulltext
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