contributor author | Zhang, Xuesong | |
contributor author | Wang, Qian | |
contributor author | Xia, Chenhui | |
contributor author | Zhou, Chaojie | |
contributor author | Wang, Gang | |
contributor author | Cai, Jian | |
date accessioned | 2023-08-16T18:15:19Z | |
date available | 2023-08-16T18:15:19Z | |
date copyright | 3/20/2023 12:00:00 AM | |
date issued | 2023 | |
identifier issn | 1043-7398 | |
identifier other | ep_145_03_031009.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl1/handle/yetl/4291715 | |
description abstract | The technology of fan-out wafer level packaging (FOWLP) has been widely adopted for millimeter wave antenna-in-package (AiP) system integration with low interconnection parasitic parameters. Present AiP solutions using FOWLP technology generally form antenna pattern on redistribution layer, which brings design inconvenience. In our work, a low-cost printed circuit board RO4350B laminate for substrate-integrated waveguide (SIW) antenna with a relatively large size is integrated, forms a three-dimensional stacked structure. The AiP employs a right-angle transition board embedded in epoxy molding compound (EMC), which transmits millimeter-wave signal to the SIW antenna stacked on the backside of EMC. The SIW antenna consists of 4 × 4 radiation slots with modified magneto-electric dipole for bandwidth enhancement. The measured gain is 14dBi at 60 GHz with bandwidth beyond 55–65 GHz. The three-dimensional AiP structure improves heat dissipation, no extra thermal design is needed for applications under 0.5 W mm-wave chip power consumption. The AiP module is manufactured and measured on the test board. The proposed approach is a convenient solution for wide band and high gain millimeter wave AiP system integration. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology | |
type | Journal Paper | |
journal volume | 145 | |
journal issue | 3 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.4056991 | |
journal fristpage | 31009-1 | |
journal lastpage | 31009-11 | |
page | 11 | |
tree | Journal of Electronic Packaging:;2023:;volume( 145 ):;issue: 003 | |
contenttype | Fulltext | |