Multi-Physics Models of a Low-Voltage Power Semiconductor System-in-Package for Automotive ApplicationsSource: Journal of Electronic Packaging:;2022:;volume( 145 ):;issue: 003::page 31003-1Author:Mauromicale, Giuseppe
,
Calabretta, Michele
,
Scarcella, Giuseppe
,
Scelba, Giacomo
,
Sitta, Alessandro
DOI: 10.1115/1.4056413Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Power converters and semiconductor devices are spreading their application fields, due to new renewable energy and automotive frameworks. In the electrified vehicles context, the even more stringent requirements, both in terms of performances and reliability, pose new challenges in the design phase of power switches. This paper analyzes, by means of finite-element simulations, a low-voltage power semiconductor system-in-package devoted to automotive applications, which integrates a MOSFET-based half bridge and a controller. Three simulation physical domains integrated in a unique flow are considered: thermo-mechanical, electromagnetic, and thermal numerical models. The aim is to develop a new comprehensive methodology which starts with a thermo-structural simulation of the package, then computes the on-state resistance and parasitic components to assess the electrical behavior of the package. Finally, a simulation check is made to verify if the power device performances are thermally consistent with applicative conditions.
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contributor author | Mauromicale, Giuseppe | |
contributor author | Calabretta, Michele | |
contributor author | Scarcella, Giuseppe | |
contributor author | Scelba, Giacomo | |
contributor author | Sitta, Alessandro | |
date accessioned | 2023-08-16T18:15:08Z | |
date available | 2023-08-16T18:15:08Z | |
date copyright | 12/23/2022 12:00:00 AM | |
date issued | 2022 | |
identifier issn | 1043-7398 | |
identifier other | ep_145_03_031003.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl1/handle/yetl/4291709 | |
description abstract | Power converters and semiconductor devices are spreading their application fields, due to new renewable energy and automotive frameworks. In the electrified vehicles context, the even more stringent requirements, both in terms of performances and reliability, pose new challenges in the design phase of power switches. This paper analyzes, by means of finite-element simulations, a low-voltage power semiconductor system-in-package devoted to automotive applications, which integrates a MOSFET-based half bridge and a controller. Three simulation physical domains integrated in a unique flow are considered: thermo-mechanical, electromagnetic, and thermal numerical models. The aim is to develop a new comprehensive methodology which starts with a thermo-structural simulation of the package, then computes the on-state resistance and parasitic components to assess the electrical behavior of the package. Finally, a simulation check is made to verify if the power device performances are thermally consistent with applicative conditions. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Multi-Physics Models of a Low-Voltage Power Semiconductor System-in-Package for Automotive Applications | |
type | Journal Paper | |
journal volume | 145 | |
journal issue | 3 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.4056413 | |
journal fristpage | 31003-1 | |
journal lastpage | 31003-10 | |
page | 10 | |
tree | Journal of Electronic Packaging:;2022:;volume( 145 ):;issue: 003 | |
contenttype | Fulltext |