Special Issue on InterPACK2020Source: Journal of Electronic Packaging:;2022:;volume( 144 ):;issue: 002::page 20301-1DOI: 10.1115/1.4053122Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The microelectronics packaging industry is facing challenges to meet demanding performance and functional needs of modern microprocessors, radio frequency components, and power electronic devices for various product segments including personal computers, data centers, mobile devices, power converters, and automotive electronics. To realize the new era of big data, the semiconductor industry has launched new technologies, including heterogeneous integration, 2.5D/3D electronic packaging, chiplet, additive manufacturing, novel modeling and characterization techniques, and others. InterPACK is a premier international forum for the exchange of state-of-the-art knowledge in research, development, and applications of electronic and photonic packaging. It is the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD). This Special Issue of the ASME Journal of Electronic Packaging (JEP) publishes papers presented at the InterPACK2020 conference to disseminate latest advancements in the areas of electronics and photonics packaging, device to package level thermal management, and others. All papers published in this JEP Special Issue for InterPACK2020 have gone through a peer-review process in accordance with the editorial procedures of JEP.
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| contributor author | Yang, Jin | |
| contributor author | Choi, Sukwon | |
| contributor author | Lee, Jaeho | |
| contributor author | Karajgikar, Saket | |
| date accessioned | 2022-05-08T09:05:33Z | |
| date available | 2022-05-08T09:05:33Z | |
| date copyright | 1/4/2022 12:00:00 AM | |
| date issued | 2022 | |
| identifier issn | 1043-7398 | |
| identifier other | ep_144_02_020301.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl1/handle/yetl/4284721 | |
| description abstract | The microelectronics packaging industry is facing challenges to meet demanding performance and functional needs of modern microprocessors, radio frequency components, and power electronic devices for various product segments including personal computers, data centers, mobile devices, power converters, and automotive electronics. To realize the new era of big data, the semiconductor industry has launched new technologies, including heterogeneous integration, 2.5D/3D electronic packaging, chiplet, additive manufacturing, novel modeling and characterization techniques, and others. InterPACK is a premier international forum for the exchange of state-of-the-art knowledge in research, development, and applications of electronic and photonic packaging. It is the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD). This Special Issue of the ASME Journal of Electronic Packaging (JEP) publishes papers presented at the InterPACK2020 conference to disseminate latest advancements in the areas of electronics and photonics packaging, device to package level thermal management, and others. All papers published in this JEP Special Issue for InterPACK2020 have gone through a peer-review process in accordance with the editorial procedures of JEP. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Special Issue on InterPACK2020 | |
| type | Journal Paper | |
| journal volume | 144 | |
| journal issue | 2 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.4053122 | |
| journal fristpage | 20301-1 | |
| journal lastpage | 20301-1 | |
| page | 1 | |
| tree | Journal of Electronic Packaging:;2022:;volume( 144 ):;issue: 002 | |
| contenttype | Fulltext |