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    Flexure and Twist Test Reliability Assurance of Flexible Electronics

    Source: Journal of Electronic Packaging:;2020:;volume( 142 ):;issue: 003::page 031121-1
    Author:
    Lall, Pradeep
    ,
    Narangaparambil, Jinesh
    ,
    Leever, Ben
    ,
    Miller, Scott
    DOI: 10.1115/1.4047844
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Additively printed flexible electronics in wearable application may be subjected to twisting or flexing depending on the form factor and the intended use. There is a dearth of standards for testing and reliability assurance of flexible electronics and reliability data for various use conditions. In this paper, a test protocol has been developed for twisting and flexing on aerosol-jet additively printed flexible circuits. Test patterns with commonly used traces geometries have been developed, aerosol-jet printed, and thermally sintered at various conditions. Effect of sintering temperature on fatigue robustness in cyclic-flexing and cyclic-twisting has been studied for straight, horse-shoe, and zig-zag trace geometries. Reliability data have been acquired under both twist and flex using continuous resistance monitoring until 100,000 cycles. Failure mechanisms have been studied for both cyclic-flexure and cyclic-twist using scanning electron microscopy (SEM) and optical imaging.
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      Flexure and Twist Test Reliability Assurance of Flexible Electronics

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    http://yetl.yabesh.ir/yetl1/handle/yetl/4274595
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    contributor authorLall, Pradeep
    contributor authorNarangaparambil, Jinesh
    contributor authorLeever, Ben
    contributor authorMiller, Scott
    date accessioned2022-02-04T21:57:20Z
    date available2022-02-04T21:57:20Z
    date copyright8/7/2020 12:00:00 AM
    date issued2020
    identifier issn1043-7398
    identifier otherep_143_02_021001.pdf
    identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4274595
    description abstractAdditively printed flexible electronics in wearable application may be subjected to twisting or flexing depending on the form factor and the intended use. There is a dearth of standards for testing and reliability assurance of flexible electronics and reliability data for various use conditions. In this paper, a test protocol has been developed for twisting and flexing on aerosol-jet additively printed flexible circuits. Test patterns with commonly used traces geometries have been developed, aerosol-jet printed, and thermally sintered at various conditions. Effect of sintering temperature on fatigue robustness in cyclic-flexing and cyclic-twisting has been studied for straight, horse-shoe, and zig-zag trace geometries. Reliability data have been acquired under both twist and flex using continuous resistance monitoring until 100,000 cycles. Failure mechanisms have been studied for both cyclic-flexure and cyclic-twist using scanning electron microscopy (SEM) and optical imaging.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleFlexure and Twist Test Reliability Assurance of Flexible Electronics
    typeJournal Paper
    journal volume142
    journal issue3
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.4047844
    journal fristpage031121-1
    journal lastpage031121-12
    page12
    treeJournal of Electronic Packaging:;2020:;volume( 142 ):;issue: 003
    contenttypeFulltext
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