| contributor author | Wang, Jun | |
| contributor author | Zhao, Yang | |
| contributor author | Chen, Han | |
| contributor author | Tang, Yan | |
| contributor author | Liu, Guozhen | |
| contributor author | Liang, Renli | |
| contributor author | Dai, Jiangnan | |
| contributor author | Chen, Changqing | |
| contributor author | Kang, Junyong | |
| contributor author | Cai, Duanjun | |
| date accessioned | 2022-02-04T14:33:46Z | |
| date available | 2022-02-04T14:33:46Z | |
| date copyright | 2020/04/17/ | |
| date issued | 2020 | |
| identifier issn | 1043-7398 | |
| identifier other | ep_142_03_031102.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl1/handle/yetl/4273917 | |
| description abstract | We demonstrate a novel ultraviolet (UV) light irradiation strategy to rapidly weld Cu nanowires (NWs) network and remove the organic residues for transparent electrodes. Shortly irradiated by UV light source, the Cu NWs could achieve junction welding in the absence of any thermal annealing process. This Cu NWs network shows high optoelectronic performance (39 Ω/sq at 90% transmittance at 550 nm) and outstanding flexibility under bending and twisting. Completely transparent light-emitting diode (LED) chips array was fabricated and has been lighted with bright top-surface emission. This method could provide a fast and convenient way to fabricate Cu NWs transparent electrodes onto various optoelectronic products. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Rapid Anneal-Free Welding of Cu Nanowires Network by Ultraviolet Light Irradiation for Transparent Electrodes in Optoelectronic Applications | |
| type | Journal Paper | |
| journal volume | 142 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.4046764 | |
| page | 31102 | |
| tree | Journal of Electronic Packaging:;2020:;volume( 142 ):;issue: 003 | |
| contenttype | Fulltext | |
