Special Issue on InterPACK 2018Source: Journal of Electronic Packaging:;2019:;volume( 141 ):;issue: 003::page 30301Author:Dede, Ercan M.
,
Boteler, Lauren
,
Chen, Changqing
,
Gromala, Przemyslaw Jakub
,
Leever, Benjamin
,
Li, Wei
DOI: 10.1115/1.4043484Publisher: American Society of Mechanical Engineers (ASME)
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| contributor author | Dede, Ercan M. | |
| contributor author | Boteler, Lauren | |
| contributor author | Chen, Changqing | |
| contributor author | Gromala, Przemyslaw Jakub | |
| contributor author | Leever, Benjamin | |
| contributor author | Li, Wei | |
| date accessioned | 2019-09-18T09:08:10Z | |
| date available | 2019-09-18T09:08:10Z | |
| date copyright | 5/8/2019 12:00:00 AM | |
| date issued | 2019 | |
| identifier issn | 1043-7398 | |
| identifier other | ep_141_03_030301 | |
| identifier uri | http://yetl.yabesh.ir/yetl1/handle/yetl/4259272 | |
| publisher | American Society of Mechanical Engineers (ASME) | |
| title | Special Issue on InterPACK 2018 | |
| type | Journal Paper | |
| journal volume | 141 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.4043484 | |
| journal fristpage | 30301 | |
| journal lastpage | 030301-1 | |
| tree | Journal of Electronic Packaging:;2019:;volume( 141 ):;issue: 003 | |
| contenttype | Fulltext |