Impact of Server Thermal Design on the Cooling Efficiency: Chassis DesignSource: Journal of Electronic Packaging:;2019:;volume( 141 ):;issue: 003::page 31004Author:Khalili, Sadegh
,
Alissa, Husam
,
Nemati, Kourosh
,
Seymour, Mark
,
Curtis, Robert
,
Moss, David
,
Sammakia, Bahgat
DOI: 10.1115/1.4042983Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: There are various designs for segregating hot and cold air in data centers such as cold aisle containment (CAC), hot aisle containment (HAC), and chimney exhaust rack. These containment systems have different characteristics and impose various conditions on the information technology equipment (ITE). One common issue in HAC systems is a pressure build-up inside the HAC (known as backpressure). Backpressure also can be present in CAC systems in case of airflow imbalances. Hot air recirculation, limited cooling airflow rate in servers, and reversed flow through ITE with weaker fan systems (e.g., network switches) are some known consequences of backpressure. Currently, there is a lack of experimental data on the interdependency between overall performance of ITE and its internal design when backpressure is imposed on ITE. In this paper, three commercial 2-rack unit (RU) servers with different internal designs from various generations and performance levels are tested and analyzed under various environmental conditions. Smoke tests and thermal imaging are implemented to study the airflow patterns inside the tested equipment. In addition, the impact of hot air leakage into the servers through chassis perforations on the fan speed and the power consumption of the servers are studied. Furthermore, the cause of the discrepancy between measured inlet temperatures by the intelligent platform management interface (IPMI) and external sensors is investigated. It is found that arrangement of fans, segregation of space upstream and downstream of fans, leakage paths, the location of baseboard management controller (BMC) sensors, and the presence of backpressure can have a significant impact on ITE power and cooling efficiency.
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contributor author | Khalili, Sadegh | |
contributor author | Alissa, Husam | |
contributor author | Nemati, Kourosh | |
contributor author | Seymour, Mark | |
contributor author | Curtis, Robert | |
contributor author | Moss, David | |
contributor author | Sammakia, Bahgat | |
date accessioned | 2019-06-08T09:30:01Z | |
date available | 2019-06-08T09:30:01Z | |
date copyright | 4/10/2019 12:00:00 AM | |
date issued | 2019 | |
identifier issn | 1043-7398 | |
identifier other | ep_141_03_031004.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl1/handle/yetl/4257838 | |
description abstract | There are various designs for segregating hot and cold air in data centers such as cold aisle containment (CAC), hot aisle containment (HAC), and chimney exhaust rack. These containment systems have different characteristics and impose various conditions on the information technology equipment (ITE). One common issue in HAC systems is a pressure build-up inside the HAC (known as backpressure). Backpressure also can be present in CAC systems in case of airflow imbalances. Hot air recirculation, limited cooling airflow rate in servers, and reversed flow through ITE with weaker fan systems (e.g., network switches) are some known consequences of backpressure. Currently, there is a lack of experimental data on the interdependency between overall performance of ITE and its internal design when backpressure is imposed on ITE. In this paper, three commercial 2-rack unit (RU) servers with different internal designs from various generations and performance levels are tested and analyzed under various environmental conditions. Smoke tests and thermal imaging are implemented to study the airflow patterns inside the tested equipment. In addition, the impact of hot air leakage into the servers through chassis perforations on the fan speed and the power consumption of the servers are studied. Furthermore, the cause of the discrepancy between measured inlet temperatures by the intelligent platform management interface (IPMI) and external sensors is investigated. It is found that arrangement of fans, segregation of space upstream and downstream of fans, leakage paths, the location of baseboard management controller (BMC) sensors, and the presence of backpressure can have a significant impact on ITE power and cooling efficiency. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Impact of Server Thermal Design on the Cooling Efficiency: Chassis Design | |
type | Journal Paper | |
journal volume | 141 | |
journal issue | 3 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.4042983 | |
journal fristpage | 31004 | |
journal lastpage | 031004-11 | |
tree | Journal of Electronic Packaging:;2019:;volume( 141 ):;issue: 003 | |
contenttype | Fulltext |