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    Impact of Server Thermal Design on the Cooling Efficiency: Chassis Design

    Source: Journal of Electronic Packaging:;2019:;volume( 141 ):;issue: 003::page 31004
    Author:
    Khalili, Sadegh
    ,
    Alissa, Husam
    ,
    Nemati, Kourosh
    ,
    Seymour, Mark
    ,
    Curtis, Robert
    ,
    Moss, David
    ,
    Sammakia, Bahgat
    DOI: 10.1115/1.4042983
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: There are various designs for segregating hot and cold air in data centers such as cold aisle containment (CAC), hot aisle containment (HAC), and chimney exhaust rack. These containment systems have different characteristics and impose various conditions on the information technology equipment (ITE). One common issue in HAC systems is a pressure build-up inside the HAC (known as backpressure). Backpressure also can be present in CAC systems in case of airflow imbalances. Hot air recirculation, limited cooling airflow rate in servers, and reversed flow through ITE with weaker fan systems (e.g., network switches) are some known consequences of backpressure. Currently, there is a lack of experimental data on the interdependency between overall performance of ITE and its internal design when backpressure is imposed on ITE. In this paper, three commercial 2-rack unit (RU) servers with different internal designs from various generations and performance levels are tested and analyzed under various environmental conditions. Smoke tests and thermal imaging are implemented to study the airflow patterns inside the tested equipment. In addition, the impact of hot air leakage into the servers through chassis perforations on the fan speed and the power consumption of the servers are studied. Furthermore, the cause of the discrepancy between measured inlet temperatures by the intelligent platform management interface (IPMI) and external sensors is investigated. It is found that arrangement of fans, segregation of space upstream and downstream of fans, leakage paths, the location of baseboard management controller (BMC) sensors, and the presence of backpressure can have a significant impact on ITE power and cooling efficiency.
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      Impact of Server Thermal Design on the Cooling Efficiency: Chassis Design

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    http://yetl.yabesh.ir/yetl1/handle/yetl/4257838
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    • Journal of Electronic Packaging

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    contributor authorKhalili, Sadegh
    contributor authorAlissa, Husam
    contributor authorNemati, Kourosh
    contributor authorSeymour, Mark
    contributor authorCurtis, Robert
    contributor authorMoss, David
    contributor authorSammakia, Bahgat
    date accessioned2019-06-08T09:30:01Z
    date available2019-06-08T09:30:01Z
    date copyright4/10/2019 12:00:00 AM
    date issued2019
    identifier issn1043-7398
    identifier otherep_141_03_031004.pdf
    identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4257838
    description abstractThere are various designs for segregating hot and cold air in data centers such as cold aisle containment (CAC), hot aisle containment (HAC), and chimney exhaust rack. These containment systems have different characteristics and impose various conditions on the information technology equipment (ITE). One common issue in HAC systems is a pressure build-up inside the HAC (known as backpressure). Backpressure also can be present in CAC systems in case of airflow imbalances. Hot air recirculation, limited cooling airflow rate in servers, and reversed flow through ITE with weaker fan systems (e.g., network switches) are some known consequences of backpressure. Currently, there is a lack of experimental data on the interdependency between overall performance of ITE and its internal design when backpressure is imposed on ITE. In this paper, three commercial 2-rack unit (RU) servers with different internal designs from various generations and performance levels are tested and analyzed under various environmental conditions. Smoke tests and thermal imaging are implemented to study the airflow patterns inside the tested equipment. In addition, the impact of hot air leakage into the servers through chassis perforations on the fan speed and the power consumption of the servers are studied. Furthermore, the cause of the discrepancy between measured inlet temperatures by the intelligent platform management interface (IPMI) and external sensors is investigated. It is found that arrangement of fans, segregation of space upstream and downstream of fans, leakage paths, the location of baseboard management controller (BMC) sensors, and the presence of backpressure can have a significant impact on ITE power and cooling efficiency.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleImpact of Server Thermal Design on the Cooling Efficiency: Chassis Design
    typeJournal Paper
    journal volume141
    journal issue3
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.4042983
    journal fristpage31004
    journal lastpage031004-11
    treeJournal of Electronic Packaging:;2019:;volume( 141 ):;issue: 003
    contenttypeFulltext
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian
     
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian