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contributor authorXie, Bin
contributor authorLiu, Haochen
contributor authorSun, Xiao Wei
contributor authorYu, Xingjian
contributor authorWu, Ruikang
contributor authorWang, Kai
contributor authorLuo, Xiaobing
date accessioned2019-06-08T09:30:01Z
date available2019-06-08T09:30:01Z
date copyright4/10/2019 12:00:00 AM
date issued2019
identifier issn1043-7398
identifier otherep_141_03_031001.pdf
identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4257836
description abstractWhite light-emitting diodes (WLEDs) composed of blue LED chip, yellow phosphor, and red quantum dots (QDs) are considered as a potential alternative for next-generation artificial light source with their high luminous efficiency (LE) and color-rendering index (CRI) while QDs' poor temperature stability and the incompatibility of QDs/silicone severely hinder the wide utilization of QDs-WLEDs. To relieve this, here we proposed a separated QDs@silica nanoparticles (QSNs)/phosphor structure, which composed of a QSNs-on-chip layer with a yellow phosphor layer above. A silica shell was coated onto the QDs surface to solve the compatibility problem between QDs and silicone. With CRI > 92 and R9 > 90, the newly proposed QSNs-based WLEDs present 16.7% higher LE and lower QDs working temperature over conventional mixed type WLEDs. The reduction of QDs' temperature can reach 11.5 °C, 21.3 °C, and 30.3 °C at driving current of 80 mA, 200 mA, and 300 mA, respectively.
publisherThe American Society of Mechanical Engineers (ASME)
titleReduced Working Temperature of Quantum Dots-Light-Emitting Diodes Optimized by Quantum Dots at Silica-on-Chip Structure
typeJournal Paper
journal volume141
journal issue3
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.4042981
journal fristpage31001
journal lastpage031001-6
treeJournal of Electronic Packaging:;2019:;volume( 141 ):;issue: 003
contenttypeFulltext


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