Special Section of Review Articles From Intel CorporationSource: Journal of Electronic Packaging:;2019:;volume( 141 ):;issue: 001::page 10301Author:Yang, Jin
DOI: 10.1115/1.4042803Publisher: The American Society of Mechanical Engineers (ASME)
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| contributor author | Yang, Jin | |
| date accessioned | 2019-06-08T09:29:57Z | |
| date available | 2019-06-08T09:29:57Z | |
| date copyright | 3/6/2019 12:00:00 AM | |
| date issued | 2019 | |
| identifier issn | 1043-7398 | |
| identifier other | ep_141_01_010301.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl1/handle/yetl/4257825 | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Special Section of Review Articles From Intel Corporation | |
| type | Journal Paper | |
| journal volume | 141 | |
| journal issue | 1 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.4042803 | |
| journal fristpage | 10301 | |
| journal lastpage | 010301-1 | |
| tree | Journal of Electronic Packaging:;2019:;volume( 141 ):;issue: 001 | |
| contenttype | Fulltext |