Special Section on InterPACK 2017—Part 2Source: Journal of Electronic Packaging:;2018:;volume( 140 ):;issue: 002::page 20301DOI: 10.1115/1.4039963Publisher: The American Society of Mechanical Engineers (ASME)
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| contributor author | Mysore, Kaushik | |
| contributor author | Narumanchi, Sreekant | |
| contributor author | Dede, Ercan | |
| contributor author | Khiabani, Reza | |
| date accessioned | 2019-02-28T11:14:18Z | |
| date available | 2019-02-28T11:14:18Z | |
| date copyright | 5/9/2018 12:00:00 AM | |
| date issued | 2018 | |
| identifier issn | 1043-7398 | |
| identifier other | ep_140_02_020301.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl1/handle/yetl/4254168 | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Special Section on InterPACK 2017—Part 2 | |
| type | Journal Paper | |
| journal volume | 140 | |
| journal issue | 2 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.4039963 | |
| journal fristpage | 20301 | |
| journal lastpage | 020301-1 | |
| tree | Journal of Electronic Packaging:;2018:;volume( 140 ):;issue: 002 | |
| contenttype | Fulltext |