Special Section on InterPACK 2017—Part 1Source: Journal of Electronic Packaging:;2018:;volume( 140 ):;issue: 001::page 10301DOI: 10.1115/1.4039090Publisher: The American Society of Mechanical Engineers (ASME)
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contributor author | Mysore, Kaushik | |
contributor author | Narumanchi, Sreekant | |
contributor author | Dede, Ercan | |
contributor author | Khiabani, Reza | |
date accessioned | 2019-02-28T11:14:18Z | |
date available | 2019-02-28T11:14:18Z | |
date copyright | 3/2/2018 12:00:00 AM | |
date issued | 2018 | |
identifier issn | 1043-7398 | |
identifier other | ep_140_01_010301.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl1/handle/yetl/4254166 | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Special Section on InterPACK 2017—Part 1 | |
type | Journal Paper | |
journal volume | 140 | |
journal issue | 1 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.4039090 | |
journal fristpage | 10301 | |
journal lastpage | 010301-1 | |
tree | Journal of Electronic Packaging:;2018:;volume( 140 ):;issue: 001 | |
contenttype | Fulltext |