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    Vibration-Induced Failures in Automotive Electronics: Knowledge-Based Qualification Perspective

    Source: Journal of Electronic Packaging:;2018:;volume( 140 ):;issue: 002::page 20905
    Author:
    Meyyappan, Karumbu
    ,
    Vujosevic, Milena
    ,
    Wu, Qifeng
    ,
    Malatkar, Pramod
    ,
    Hill, Charles
    ,
    Parrott, Ryan
    DOI: 10.1115/1.4039301
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper intends to address an important gap between reliability standards and the physics of how components respond to real use conditions using a knowledge-based qualification (KBQ) process. Bridging the gap is essential to developing test methods that better reflect field performance. With the growth in importance of automotive market and the wide usage of electronics in this market, vibration-induced failures was chosen for this study. MIL-STD-810G and ISTA4AB are couple of industry standards that address the risk of shipping finished goods to a customer. For automotive electronic products that are exposed to vibration conditions all through their life, USCAR-2 and GMW3172 are more relevant. Even though the usage models and transportation duration for shipping fully packaged systems is different from automotive electronics, the source of energy (road conditions), driving the risks, are similar. The industry standards-based damage models appear to be generic, covering a wide variety of products and failure modes. Whereas, the KBQ framework, used in this paper, maps use conditions to accelerated test requirements for only two failure modes: solder joint fatigue and socket contact fretting. The mechanisms were chosen to be distinct with different damage metric and drivers. The process is intended to explain how industry standards reflect field risks for two of the risks relevant for automotive electronics.
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      Vibration-Induced Failures in Automotive Electronics: Knowledge-Based Qualification Perspective

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    contributor authorMeyyappan, Karumbu
    contributor authorVujosevic, Milena
    contributor authorWu, Qifeng
    contributor authorMalatkar, Pramod
    contributor authorHill, Charles
    contributor authorParrott, Ryan
    date accessioned2019-02-28T11:14:17Z
    date available2019-02-28T11:14:17Z
    date copyright5/9/2018 12:00:00 AM
    date issued2018
    identifier issn1043-7398
    identifier otherep_140_02_020905.pdf
    identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4254165
    description abstractThis paper intends to address an important gap between reliability standards and the physics of how components respond to real use conditions using a knowledge-based qualification (KBQ) process. Bridging the gap is essential to developing test methods that better reflect field performance. With the growth in importance of automotive market and the wide usage of electronics in this market, vibration-induced failures was chosen for this study. MIL-STD-810G and ISTA4AB are couple of industry standards that address the risk of shipping finished goods to a customer. For automotive electronic products that are exposed to vibration conditions all through their life, USCAR-2 and GMW3172 are more relevant. Even though the usage models and transportation duration for shipping fully packaged systems is different from automotive electronics, the source of energy (road conditions), driving the risks, are similar. The industry standards-based damage models appear to be generic, covering a wide variety of products and failure modes. Whereas, the KBQ framework, used in this paper, maps use conditions to accelerated test requirements for only two failure modes: solder joint fatigue and socket contact fretting. The mechanisms were chosen to be distinct with different damage metric and drivers. The process is intended to explain how industry standards reflect field risks for two of the risks relevant for automotive electronics.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleVibration-Induced Failures in Automotive Electronics: Knowledge-Based Qualification Perspective
    typeJournal Paper
    journal volume140
    journal issue2
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.4039301
    journal fristpage20905
    journal lastpage020905-12
    treeJournal of Electronic Packaging:;2018:;volume( 140 ):;issue: 002
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian