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    Experimental Investigation of Embedded Micropin-Fins for Single-Phase Heat Transfer and Pressure Drop

    Source: Journal of Electronic Packaging:;2018:;volume( 140 ):;issue: 002::page 21001
    Author:
    Kharangate, Chirag R.
    ,
    Wook Jung, Ki
    ,
    Jung, Sangwoo
    ,
    Kong, Daeyoung
    ,
    Schaadt, Joseph
    ,
    Iyengar, Madhusudan
    ,
    Malone, Chris
    ,
    Lee, Hyoungsoon
    ,
    Asheghi, Mehdi
    ,
    Goodson, Kenneth E.
    DOI: 10.1115/1.4039475
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Three-dimensional (3D) stacked integrated circuit (IC) chips offer significant performance improvement, but offer important challenges for thermal management including, for the case of microfluidic cooling, constraints on channel dimensions, and pressure drop. Here, we investigate heat transfer and pressure drop characteristics of a microfluidic cooling device with staggered pin-fin array arrangement with dimensions as follows: diameter D = 46.5 μm; spacing, S ∼ 100 μm; and height, H ∼ 110 μm. Deionized single-phase water with mass flow rates of m˙ = 15.1–64.1 g/min was used as the working fluid, corresponding to values of Re (based on pin fin diameter) from 23 to 135, where heat fluxes up to 141 W/cm2 are removed. The measurements yield local Nusselt numbers that vary little along the heated channel length and values for both the Nu and the friction factor do not agree well with most data for pin fin geometries in the literature. Two new correlations for the average Nusselt number (∼Re1.04) and Fanning friction factor (∼Re−0.52) are proposed that capture the heat transfer and pressure drop behavior for the geometric and operating conditions tested in this study with mean absolute error (MAE) of 4.9% and 1.7%, respectively. The work shows that a more comprehensive investigation is required on thermofluidic characterization of pin fin arrays with channel heights Hf < 150 μm and fin spacing S = 50–500 μm, respectively, with the Reynolds number, Re < 300.
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      Experimental Investigation of Embedded Micropin-Fins for Single-Phase Heat Transfer and Pressure Drop

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    contributor authorKharangate, Chirag R.
    contributor authorWook Jung, Ki
    contributor authorJung, Sangwoo
    contributor authorKong, Daeyoung
    contributor authorSchaadt, Joseph
    contributor authorIyengar, Madhusudan
    contributor authorMalone, Chris
    contributor authorLee, Hyoungsoon
    contributor authorAsheghi, Mehdi
    contributor authorGoodson, Kenneth E.
    date accessioned2019-02-28T11:14:15Z
    date available2019-02-28T11:14:15Z
    date copyright5/9/2018 12:00:00 AM
    date issued2018
    identifier issn1043-7398
    identifier otherep_140_02_021001.pdf
    identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4254159
    description abstractThree-dimensional (3D) stacked integrated circuit (IC) chips offer significant performance improvement, but offer important challenges for thermal management including, for the case of microfluidic cooling, constraints on channel dimensions, and pressure drop. Here, we investigate heat transfer and pressure drop characteristics of a microfluidic cooling device with staggered pin-fin array arrangement with dimensions as follows: diameter D = 46.5 μm; spacing, S ∼ 100 μm; and height, H ∼ 110 μm. Deionized single-phase water with mass flow rates of m˙ = 15.1–64.1 g/min was used as the working fluid, corresponding to values of Re (based on pin fin diameter) from 23 to 135, where heat fluxes up to 141 W/cm2 are removed. The measurements yield local Nusselt numbers that vary little along the heated channel length and values for both the Nu and the friction factor do not agree well with most data for pin fin geometries in the literature. Two new correlations for the average Nusselt number (∼Re1.04) and Fanning friction factor (∼Re−0.52) are proposed that capture the heat transfer and pressure drop behavior for the geometric and operating conditions tested in this study with mean absolute error (MAE) of 4.9% and 1.7%, respectively. The work shows that a more comprehensive investigation is required on thermofluidic characterization of pin fin arrays with channel heights Hf < 150 μm and fin spacing S = 50–500 μm, respectively, with the Reynolds number, Re < 300.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleExperimental Investigation of Embedded Micropin-Fins for Single-Phase Heat Transfer and Pressure Drop
    typeJournal Paper
    journal volume140
    journal issue2
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.4039475
    journal fristpage21001
    journal lastpage021001-12
    treeJournal of Electronic Packaging:;2018:;volume( 140 ):;issue: 002
    contenttypeFulltext
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