Diagonal Mode van der Pauw Stress Sensors: Proof of Diagonal-Mode ConjectureSource: Journal of Electronic Packaging:;2018:;volume( 140 ):;issue: 004::page 44501DOI: 10.1115/1.4040829Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The conjecture discussed in our previous paper [Jaeger, R. C., Motalab, M., Hussain, S., and Suhling, J. C., 2014, “Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors,” ASME J. Electron. Packag., 136(4), p. 041014; Jaeger, R. C., Motalab, M., Hussain, S., and Suhling, J. C., 2018, Erratum: “Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors,” ASME J. Electron. Packag., 140(1), p. 017001] was backed up by measurements and simulation results, but not mathematically proven. A proof based upon two-port impedance parameter reciprocity is presented with additional experimental confirmation.
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contributor author | Jaeger, Richard C. | |
contributor author | Suhling, Jeffrey C. | |
contributor author | Chen, Jun | |
date accessioned | 2019-02-28T11:14:15Z | |
date available | 2019-02-28T11:14:15Z | |
date copyright | 8/3/2018 12:00:00 AM | |
date issued | 2018 | |
identifier issn | 1043-7398 | |
identifier other | ep_140_04_044501.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl1/handle/yetl/4254157 | |
description abstract | The conjecture discussed in our previous paper [Jaeger, R. C., Motalab, M., Hussain, S., and Suhling, J. C., 2014, “Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors,” ASME J. Electron. Packag., 136(4), p. 041014; Jaeger, R. C., Motalab, M., Hussain, S., and Suhling, J. C., 2018, Erratum: “Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors,” ASME J. Electron. Packag., 140(1), p. 017001] was backed up by measurements and simulation results, but not mathematically proven. A proof based upon two-port impedance parameter reciprocity is presented with additional experimental confirmation. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Diagonal Mode van der Pauw Stress Sensors: Proof of Diagonal-Mode Conjecture | |
type | Journal Paper | |
journal volume | 140 | |
journal issue | 4 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.4040829 | |
journal fristpage | 44501 | |
journal lastpage | 044501-3 | |
tree | Journal of Electronic Packaging:;2018:;volume( 140 ):;issue: 004 | |
contenttype | Fulltext |