Solid-State Microjoining Mechanisms of Wire Bonding and Flip Chip BondingSource: Journal of Electronic Packaging:;2017:;volume( 139 ):;issue: 004::page 41010DOI: 10.1115/1.4038143Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Low-temperature microjoining, such as wire (or ribbon) bonding, tape automated bonding (TAB), and flip chip bonding (FCB), is necessary for electronics packaging. Each type of microjoining takes on various aspects but has common bonding mechanisms regarding friction slip, plastic deformation, and friction heating. In the present paper, solid-state microjoining mechanisms in Au wire (ball) bonding, FCB, Al wire bonding (WB), and Al ribbon bonding are discussed to systematically understand the common bonding mechanisms. Ultrasonic vibration enhances friction slip and plastic deformation, making it possible to rapidly obtain dry interconnects. Metallic adhesion at the central area of the bonding interface is mainly produced by the friction slip. On the other hand, the folding of the lateral side surfaces of the Au bump, Au ball, and Al wire is very important for increasing the bonded area. The central and peripheral adhesions are achieved by a slip-and-fold mechanism. The solid-state microjoining mechanisms of WB and FCB are discussed based on experimental results.
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contributor author | Takahashi | |
contributor author | Yasuo;Fukuda | |
contributor author | Hiroki;Yoneshima | |
contributor author | Yasuhiro;Kitamura | |
contributor author | Hideki;Maeda | |
contributor author | Masakatsu | |
date accessioned | 2017-12-30T11:44:08Z | |
date available | 2017-12-30T11:44:08Z | |
date copyright | 10/25/2017 12:00:00 AM | |
date issued | 2017 | |
identifier issn | 1043-7398 | |
identifier other | ep_139_04_041010.pdf | |
identifier uri | http://138.201.223.254:8080/yetl1/handle/yetl/4242995 | |
description abstract | Low-temperature microjoining, such as wire (or ribbon) bonding, tape automated bonding (TAB), and flip chip bonding (FCB), is necessary for electronics packaging. Each type of microjoining takes on various aspects but has common bonding mechanisms regarding friction slip, plastic deformation, and friction heating. In the present paper, solid-state microjoining mechanisms in Au wire (ball) bonding, FCB, Al wire bonding (WB), and Al ribbon bonding are discussed to systematically understand the common bonding mechanisms. Ultrasonic vibration enhances friction slip and plastic deformation, making it possible to rapidly obtain dry interconnects. Metallic adhesion at the central area of the bonding interface is mainly produced by the friction slip. On the other hand, the folding of the lateral side surfaces of the Au bump, Au ball, and Al wire is very important for increasing the bonded area. The central and peripheral adhesions are achieved by a slip-and-fold mechanism. The solid-state microjoining mechanisms of WB and FCB are discussed based on experimental results. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Solid-State Microjoining Mechanisms of Wire Bonding and Flip Chip Bonding | |
type | Journal Paper | |
journal volume | 139 | |
journal issue | 4 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.4038143 | |
journal fristpage | 41010 | |
journal lastpage | 041010-13 | |
tree | Journal of Electronic Packaging:;2017:;volume( 139 ):;issue: 004 | |
contenttype | Fulltext |