Ultraminiaturized Three-Dimensional IPAC Packages With 100 μm Thick Glass Substrates for Radio Frequency Front-End ModulesSource: Journal of Electronic Packaging:;2017:;volume( 139 ):;issue: 004::page 41001Author:Wu, Zihan
,
Min, Junki
,
Smet, Vanessa
,
Raj Pulugurtha, Markondeya
,
Sundaram, Venky
,
Tummala, Rao R.
DOI: 10.1115/1.4037221Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper presents innovative compact three-dimensional integrated passive and active components (3D IPAC) packages with ultrathin glass substrates for radio frequency (RF) long-term evolution (LTE) front-end modules (FEMs). High component density was achieved through double-side integration of substrate-embedded passives for impedance matching networks and three-dimensional (3D) double-side assembly of filters onto glass substrates. Glass with 100 μm thickness formed the core of the package, while four build-up layers with 15 μm thickness each were used to embed passives and form redistribution layers (RDLs). Advanced panel-scale double-side assembly processes were developed with low-cost mass reflow. Board-level assembly was realized with paste-printed solder balls and reflow on printed circuit board (PCB) with no intermediate substrates. Electrical performance of filters with substrate-embedded impedance matching networks was characterized and compared to simulations.
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| contributor author | Wu, Zihan | |
| contributor author | Min, Junki | |
| contributor author | Smet, Vanessa | |
| contributor author | Raj Pulugurtha, Markondeya | |
| contributor author | Sundaram, Venky | |
| contributor author | Tummala, Rao R. | |
| date accessioned | 2017-11-25T07:21:05Z | |
| date available | 2017-11-25T07:21:05Z | |
| date copyright | 2017/27/7 | |
| date issued | 2017 | |
| identifier issn | 1043-7398 | |
| identifier other | ep_139_04_041001.pdf | |
| identifier uri | http://138.201.223.254:8080/yetl1/handle/yetl/4236871 | |
| description abstract | This paper presents innovative compact three-dimensional integrated passive and active components (3D IPAC) packages with ultrathin glass substrates for radio frequency (RF) long-term evolution (LTE) front-end modules (FEMs). High component density was achieved through double-side integration of substrate-embedded passives for impedance matching networks and three-dimensional (3D) double-side assembly of filters onto glass substrates. Glass with 100 μm thickness formed the core of the package, while four build-up layers with 15 μm thickness each were used to embed passives and form redistribution layers (RDLs). Advanced panel-scale double-side assembly processes were developed with low-cost mass reflow. Board-level assembly was realized with paste-printed solder balls and reflow on printed circuit board (PCB) with no intermediate substrates. Electrical performance of filters with substrate-embedded impedance matching networks was characterized and compared to simulations. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Ultraminiaturized Three-Dimensional IPAC Packages With 100 μm Thick Glass Substrates for Radio Frequency Front-End Modules | |
| type | Journal Paper | |
| journal volume | 139 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.4037221 | |
| journal fristpage | 41001 | |
| journal lastpage | 041001-9 | |
| tree | Journal of Electronic Packaging:;2017:;volume( 139 ):;issue: 004 | |
| contenttype | Fulltext |