Flow Boiling Heat Transfer and Pressure Drops of R1234ze(E) in a Silicon Micro-pin Fin EvaporatorSource: Journal of Electronic Packaging:;2017:;volume( 139 ):;issue: 003::page 31008DOI: 10.1115/1.4037152Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The development of newer and more efficient cooling techniques to sustain the increasing power density of high-performance computing systems is becoming one of the major challenges in the development of microelectronics. In this framework, two-phase cooling is a promising solution for dissipating the greater amount of generated heat. In the present study, an experimental investigation of two-phase flow boiling in a micro-pin fin evaporator is performed. The micro-evaporator has a heated area of 1 cm2 containing 66 rows of cylindrical in-line micro-pin fins with diameter, height, and pitch of, respectively, 50 μm, 100 μm, and 91.7 μm. The working fluid is R1234ze(E) tested over a wide range of conditions: mass fluxes varying from 750 kg/m2 s to 1750 kg/m2 s and heat fluxes ranging from 20 W/cm2 to 44 W/cm2. The effects of saturation temperature on the heat transfer are investigated by testing three different outlet saturation temperatures: 25 °C, 30 °C, and 35 °C. In order to assess the thermal–hydraulic performance of the current heat sink, the total pressure drops are directly measured, while local values of heat transfer coefficient are evaluated by coupling high-speed flow visualization with infrared temperature measurements. According to the experimental results, the mass flux has the most significant impact on the heat transfer coefficient while heat flux is a less influential parameter. The vapor quality varies in a range between 0 and 0.45. The heat transfer coefficient in the subcooled region reaches a maximum value of about 12 kW/m2 K, whilst in two-phase flow it goes up to 30 kW/m2 K.
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contributor author | Falsetti, C. | |
contributor author | Magnini, M. | |
contributor author | Thome, J. R. | |
date accessioned | 2017-11-25T07:21:04Z | |
date available | 2017-11-25T07:21:04Z | |
date copyright | 2017/10/7 | |
date issued | 2017 | |
identifier issn | 1043-7398 | |
identifier other | ep_139_03_031008.pdf | |
identifier uri | http://138.201.223.254:8080/yetl1/handle/yetl/4236869 | |
description abstract | The development of newer and more efficient cooling techniques to sustain the increasing power density of high-performance computing systems is becoming one of the major challenges in the development of microelectronics. In this framework, two-phase cooling is a promising solution for dissipating the greater amount of generated heat. In the present study, an experimental investigation of two-phase flow boiling in a micro-pin fin evaporator is performed. The micro-evaporator has a heated area of 1 cm2 containing 66 rows of cylindrical in-line micro-pin fins with diameter, height, and pitch of, respectively, 50 μm, 100 μm, and 91.7 μm. The working fluid is R1234ze(E) tested over a wide range of conditions: mass fluxes varying from 750 kg/m2 s to 1750 kg/m2 s and heat fluxes ranging from 20 W/cm2 to 44 W/cm2. The effects of saturation temperature on the heat transfer are investigated by testing three different outlet saturation temperatures: 25 °C, 30 °C, and 35 °C. In order to assess the thermal–hydraulic performance of the current heat sink, the total pressure drops are directly measured, while local values of heat transfer coefficient are evaluated by coupling high-speed flow visualization with infrared temperature measurements. According to the experimental results, the mass flux has the most significant impact on the heat transfer coefficient while heat flux is a less influential parameter. The vapor quality varies in a range between 0 and 0.45. The heat transfer coefficient in the subcooled region reaches a maximum value of about 12 kW/m2 K, whilst in two-phase flow it goes up to 30 kW/m2 K. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Flow Boiling Heat Transfer and Pressure Drops of R1234ze(E) in a Silicon Micro-pin Fin Evaporator | |
type | Journal Paper | |
journal volume | 139 | |
journal issue | 3 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.4037152 | |
journal fristpage | 31008 | |
journal lastpage | 031008-8 | |
tree | Journal of Electronic Packaging:;2017:;volume( 139 ):;issue: 003 | |
contenttype | Fulltext |