contributor author | de Oliveira, Pablo A. | |
contributor author | Barbosa, , Jr., Jader R. | |
date accessioned | 2017-11-25T07:21:04Z | |
date available | 2017-11-25T07:21:04Z | |
date copyright | 2017/28/6 | |
date issued | 2017 | |
identifier issn | 1043-7398 | |
identifier other | ep_139_03_031005.pdf | |
identifier uri | http://138.201.223.254:8080/yetl1/handle/yetl/4236866 | |
description abstract | The performance of a novel impinging two-phase jet heat sink operating with single and multiple jets is presented and the influence of the following parameters is quantified: (i) thermal load applied on the heat sink and (ii) geometrical arrangement of the orifices (jets). The heat sink is part of a vapor compression cooling system equipped with an R-134a small-scale oil-free linear motor compressor. The evaporator and the expansion device are integrated into a single cooling unit. The expansion device can be a single orifice or an array of orifices responsible for the generation of two-phase jet(s) impinging on a surface where a concentrated heat load is applied. The analysis is based on the thermodynamic performance and steady-state heat transfer parameters associated with the impinging jet(s) for single and multiple orifice tests. The two-phase jet heat sink was capable of dissipating cooling loads of up to 160 W and 200 W from a 6.36 cm2 surface for single and multiple orifice configurations, respectively. For these cases, the temperature of the impingement surface was kept below 40 °C and the average heat transfer coefficient reached values between 14,000 and 16,000 W/(m2 K). | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Performance Assessment of Single and Multiple Jet Impingement Configurations in a Refrigeration-Based Compact Heat Sink for Electronics Cooling | |
type | Journal Paper | |
journal volume | 139 | |
journal issue | 3 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.4036817 | |
journal fristpage | 31005 | |
journal lastpage | 031005-11 | |
tree | Journal of Electronic Packaging:;2017:;volume( 139 ):;issue: 003 | |
contenttype | Fulltext | |