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    Overview of Human Thermal Responses to Warm Surfaces of Electronic Devices

    Source: Journal of Electronic Packaging:;2017:;volume( 139 ):;issue: 003::page 30802
    Author:
    Zhang, Han
    ,
    Hedge, Alan
    DOI: 10.1115/1.4037146
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Literature was reviewed and summarized on a few topics including: existing standards about the limits of devices' surface temperature, recent studies on the devices that caused discomfort and skin damage, human thermal sensation thresholds, the factors that affect thermal sensation, and the subjective ratings in the studies of thermal sensation. At the end, recent research on human subjective and objective testing was also summarized. The purpose of the review is to give an overview of cutaneous human thermal sensation and comfort, and how they are affected by the surface temperature of electronic devices.
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      Overview of Human Thermal Responses to Warm Surfaces of Electronic Devices

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    http://yetl.yabesh.ir/yetl1/handle/yetl/4236860
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    contributor authorZhang, Han
    contributor authorHedge, Alan
    date accessioned2017-11-25T07:21:04Z
    date available2017-11-25T07:21:04Z
    date copyright2017/13/7
    date issued2017
    identifier issn1043-7398
    identifier otherep_139_03_030802.pdf
    identifier urihttp://138.201.223.254:8080/yetl1/handle/yetl/4236860
    description abstractLiterature was reviewed and summarized on a few topics including: existing standards about the limits of devices' surface temperature, recent studies on the devices that caused discomfort and skin damage, human thermal sensation thresholds, the factors that affect thermal sensation, and the subjective ratings in the studies of thermal sensation. At the end, recent research on human subjective and objective testing was also summarized. The purpose of the review is to give an overview of cutaneous human thermal sensation and comfort, and how they are affected by the surface temperature of electronic devices.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleOverview of Human Thermal Responses to Warm Surfaces of Electronic Devices
    typeJournal Paper
    journal volume139
    journal issue3
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.4037146
    journal fristpage30802
    journal lastpage030802-9
    treeJournal of Electronic Packaging:;2017:;volume( 139 ):;issue: 003
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian