Investigation on the Optimized Binary and Ternary Gallium Alloy as Thermal Interface MaterialsSource: Journal of Electronic Packaging:;2017:;volume( 139 ):;issue: 001::page 11002DOI: 10.1115/1.4035025Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This work presents an experimental study to enhance the thermal contact conductance of high performance thermal interface materials (TIMs) using gallium alloy. In this experiment, the gallium alloy-based TIMs are synthesized by a micro-oxidation reaction method, which consists of gallium oxides (Ga2O3) dispersed uniformly in gallium alloys. An experimental apparatus is designed to measure the thermal resistance across the gallium alloy-based TIMs under steady-state conditions. The existence of Ga2O3 can effectively improve the wettability of gallium alloys with other materials. For example, they have a better wettability with copper and anodic coloring 6063 aluminum-alloy without any extrusion between the interface layers. Gallium binary alloy-based TIMs (GBTIM) or ternary alloy based-TIMs (GTTIM) are found to increase the operational temperature range comparing with that of the conventional thermal greases. The measured highest thermal conductivity is as high as 19.2 Wm−1K−1 for GBTIM at room temperature. The wide operational temperature, better wettability, and higher thermal conductivity make gallium alloy-based TIMs promising for a wider application as TIMs in electronic packaging areas. The measured resistance is found to be as low as 2.2 mm2 KW−1 for GBTIM with a pressure of 0.05 MPa, which is much lower than that of the best commercialized thermal greases. In view of controlling pollution and raw materials wasting, the gallium alloy-based TIMs can be cleaned by 30% NaOH solution, and the pure gallium alloys are recycled, which can satisfy industrial production requirements effectively.
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contributor author | Gao, Yunxia | |
contributor author | Wang, Xianping | |
contributor author | Liu, Jing | |
contributor author | Fang, Qianfeng | |
date accessioned | 2017-11-25T07:21:01Z | |
date available | 2017-11-25T07:21:01Z | |
date copyright | 2016/23/11 | |
date issued | 2017 | |
identifier issn | 1043-7398 | |
identifier other | ep_139_01_011002.pdf | |
identifier uri | http://138.201.223.254:8080/yetl1/handle/yetl/4236834 | |
description abstract | This work presents an experimental study to enhance the thermal contact conductance of high performance thermal interface materials (TIMs) using gallium alloy. In this experiment, the gallium alloy-based TIMs are synthesized by a micro-oxidation reaction method, which consists of gallium oxides (Ga2O3) dispersed uniformly in gallium alloys. An experimental apparatus is designed to measure the thermal resistance across the gallium alloy-based TIMs under steady-state conditions. The existence of Ga2O3 can effectively improve the wettability of gallium alloys with other materials. For example, they have a better wettability with copper and anodic coloring 6063 aluminum-alloy without any extrusion between the interface layers. Gallium binary alloy-based TIMs (GBTIM) or ternary alloy based-TIMs (GTTIM) are found to increase the operational temperature range comparing with that of the conventional thermal greases. The measured highest thermal conductivity is as high as 19.2 Wm−1K−1 for GBTIM at room temperature. The wide operational temperature, better wettability, and higher thermal conductivity make gallium alloy-based TIMs promising for a wider application as TIMs in electronic packaging areas. The measured resistance is found to be as low as 2.2 mm2 KW−1 for GBTIM with a pressure of 0.05 MPa, which is much lower than that of the best commercialized thermal greases. In view of controlling pollution and raw materials wasting, the gallium alloy-based TIMs can be cleaned by 30% NaOH solution, and the pure gallium alloys are recycled, which can satisfy industrial production requirements effectively. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Investigation on the Optimized Binary and Ternary Gallium Alloy as Thermal Interface Materials | |
type | Journal Paper | |
journal volume | 139 | |
journal issue | 1 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.4035025 | |
journal fristpage | 11002 | |
journal lastpage | 011002-8 | |
tree | Journal of Electronic Packaging:;2017:;volume( 139 ):;issue: 001 | |
contenttype | Fulltext |