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    Flow Boiling in Microgaps for Thermal Management of High Heat Flux Microsystems

    Source: Journal of Electronic Packaging:;2016:;volume( 138 ):;issue: 004::page 40801
    Author:
    Han, Xuefei
    ,
    Fedorov, Andrei
    ,
    Joshi, Yogendra
    DOI: 10.1115/1.4034317
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In the first part of this paper, a review of fundamental experimental studies on flow boiling in plain and surface enhanced microgaps is presented. In the second part, complimentary to the literature review, new results of subcooled flow boiling of water through a micropin-fin array heat sink with outlet pressure below atmospheric are presented. A 200 μm high microgap device design was tested, with a longitudinal pin pitch of 225 μm, a transverse pitch of 135 μm, and a diameter of 90 μm, respectively. Tested mass fluxes ranged from 1351 to 1784  kg/m2s, and effective heat flux ranged from 198 to 444 W/cm2 based on the footprint surface area. The inlet temperature varied from 6 to 12 °C, and outlet pressure ranged from 24 to 36 kPa. The two-phase heat transfer coefficient showed a decreasing trend with increasing heat flux. High-speed visualizations of flow patterns revealed a triangular wake after bubble nucleation. Flow oscillations were seen and discussed.
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      Flow Boiling in Microgaps for Thermal Management of High Heat Flux Microsystems

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    http://yetl.yabesh.ir/yetl1/handle/yetl/4236819
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    contributor authorHan, Xuefei
    contributor authorFedorov, Andrei
    contributor authorJoshi, Yogendra
    date accessioned2017-11-25T07:21:00Z
    date available2017-11-25T07:21:00Z
    date copyright2016/08/24
    date issued2016
    identifier issn1043-7398
    identifier otherep_138_04_040801.pdf
    identifier urihttp://138.201.223.254:8080/yetl1/handle/yetl/4236819
    description abstractIn the first part of this paper, a review of fundamental experimental studies on flow boiling in plain and surface enhanced microgaps is presented. In the second part, complimentary to the literature review, new results of subcooled flow boiling of water through a micropin-fin array heat sink with outlet pressure below atmospheric are presented. A 200 μm high microgap device design was tested, with a longitudinal pin pitch of 225 μm, a transverse pitch of 135 μm, and a diameter of 90 μm, respectively. Tested mass fluxes ranged from 1351 to 1784  kg/m2s, and effective heat flux ranged from 198 to 444 W/cm2 based on the footprint surface area. The inlet temperature varied from 6 to 12 °C, and outlet pressure ranged from 24 to 36 kPa. The two-phase heat transfer coefficient showed a decreasing trend with increasing heat flux. High-speed visualizations of flow patterns revealed a triangular wake after bubble nucleation. Flow oscillations were seen and discussed.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleFlow Boiling in Microgaps for Thermal Management of High Heat Flux Microsystems
    typeJournal Paper
    journal volume138
    journal issue4
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.4034317
    journal fristpage40801
    journal lastpage040801-12
    treeJournal of Electronic Packaging:;2016:;volume( 138 ):;issue: 004
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian