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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-4 of 4
Moisture Absorption and Diffusion Characterization of Molding Compound
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The moisture absorption experiments of two kinds of molding compound are conducted. The diffusion at low temperature and humidity observes the Fick’s Law, but it does not strictly obey at ...
Die Bonding of High Power 808 nm Laser Diodes With Nanosilver Paste
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Conduction-cooled high power laser diodes have a variety of significant commercial, industrial, and military applications. For these devices to perform effectively, an appropriate die-attached ...
Reliability of High-Power Light Emitting Diode Attached With Different Thermal Interface Materials
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: As a solid electroluminescent source, white light emitting diode (LED) has entered a practical stage and become an alternative to replace incandescent and fluorescent light sources. However, due ...
Strain Rate Dependent Constitutive Model of Multiaxial Ratchetting of 63Sn–37Pb Solder
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A series of multiaxial ratcheting tests were conducted on 63Sn–37Pb solder. A unified viscoplastic constitutive model was developed on the basis of the Ohno–Wang kinematic hardening model, and ...