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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-6 of 6
Numerical and Experimental Study on the Transferred Volume in Phosphor Dip Transfer Coating Process of Light Emitting Diodes Packaging
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The phosphor diptransfer coating method is simple and flexible for transferring a preanalyzed volume of phosphor gel, which can be beneficial to the high angular color uniformity (ACU) of white lightemitting diodes (LEDs). ...
Quantum Dots Converted Light Emitting Diodes Packaging for Lighting and Display: Status and Perspectives
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Recent years, semiconductor quantum dots (QDs) have attracted tremendous attentions for their unique characteristics for solidstate lighting (SSL) and thinfilm display applications. The pure and tunable spectra of QDs make ...
Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for Chip-on-Board Light-Emitting Diodes Packaging
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this study, we realized a cylindrical tuber silicone layer for improving the light efficiency of chip-on-board light-emitting diodes (COB-LEDs) by fabricating patterned LED substrate with both silicone-wetting and ...
Reduced Working Temperature of Quantum Dots-Light-Emitting Diodes Optimized by Quantum Dots at Silica-on-Chip Structure
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: White light-emitting diodes (WLEDs) composed of blue LED chip, yellow phosphor, and red quantum dots (QDs) are considered as a potential alternative for next-generation artificial light source with their high luminous ...
Reduced Working Temperature of Quantum Dots-Light-Emitting Diodes Optimized by Quantum Dots at Silica-on-Chip Structure
Publisher: American Society of Mechanical Engineers (ASME)
Abstract: White light-emitting diodes (WLEDs) composed of blue LED chip, yellow phosphor, and red quantum dots (QDs) are considered as a potential alternative for next-generation artificial light source with their high luminous ...
Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for Chip-on-Board Light-Emitting Diodes Packaging
Publisher: American Society of Mechanical Engineers (ASME)
Abstract: In this study, we realized a cylindrical tuber silicone layer for improving the light efficiency of chip-on-board light-emitting diodes (COB-LEDs) by fabricating patterned LED substrate with both silicone-wetting and ...