contributor author | Shang, Bofeng | |
contributor author | Yu, Xingjian | |
contributor author | Zheng, Huai | |
contributor author | Xie, Bin | |
contributor author | Chen, Qi | |
contributor author | Luo, Xiaobing | |
date accessioned | 2017-05-09T01:27:30Z | |
date available | 2017-05-09T01:27:30Z | |
date issued | 2016 | |
identifier issn | 1528-9044 | |
identifier other | med_010_02_020934.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/160817 | |
description abstract | The phosphor diptransfer coating method is simple and flexible for transferring a preanalyzed volume of phosphor gel, which can be beneficial to the high angular color uniformity (ACU) of white lightemitting diodes (LEDs). The crux of this method is the volume control of the phosphor gel; however, the critical factors which influence the volume control remain unrevealed. In this paper, we concentrate on investigating the transferred volume in terms of three parameters: withdrawal speed, post radius, and dipping depth. Numerical simulations were carried out utilizing the volume of fluid (VOF) model combined with the dynamic mesh model. The experiments were also conducted on an optical platform equipped with a highspeed camera. The simulation results coincide well with the experimental results, with the maximum relative difference within 15%. The results show that the transferred volume increases with the increasing withdrawal speed and remains stable when the speed is greater than 1 mm/s, and it shows a linear relationship with the cube of post radius. And the transferred volume will increase with the dipping depth. Based on the experimental and numerically work, it is concluded that the volume of the preanalyzed phosphor gel can be precisely obtained. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Numerical and Experimental Study on the Transferred Volume in Phosphor Dip Transfer Coating Process of Light Emitting Diodes Packaging | |
type | Journal Paper | |
journal volume | 138 | |
journal issue | 2 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.4033165 | |
journal fristpage | 21003 | |
journal lastpage | 21003 | |
identifier eissn | 1043-7398 | |
tree | Journal of Electronic Packaging:;2016:;volume( 138 ):;issue: 002 | |
contenttype | Fulltext | |