Search
Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-2 of 2
Potential Failure Sites in a Flip-Chip Package With and Without Underfill
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this study, the effect of underfill on the level of stress concentrations is investigated and possible failure sites are identified by using a global/local finite element approach. The global ...
Moisture Migration and Cracking in Plastic Quad Flat Packages (PQFPs)
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Moisture migration in PQFPs (plastic quad flat packages) was investigated analytically and experimentally. Coupons made of the molding compound material were exposed to humid air for an extended ...