| contributor author | E. Madenci | |
| contributor author | R. Mahajan | |
| contributor author | S. Shkarayev | |
| date accessioned | 2017-05-08T23:56:13Z | |
| date available | 2017-05-08T23:56:13Z | |
| date copyright | December, 1998 | |
| date issued | 1998 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26169#336_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/120229 | |
| description abstract | In this study, the effect of underfill on the level of stress concentrations is investigated and possible failure sites are identified by using a global/local finite element approach. The global elements capture the exact singular behavior of the stresses near the geometric and material discontinuities. Application of the strain energy density criterion indicates the possible failure sites and how they shift due to the presence of underfill. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Potential Failure Sites in a Flip-Chip Package With and Without Underfill | |
| type | Journal Paper | |
| journal volume | 120 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2792643 | |
| journal fristpage | 336 | |
| journal lastpage | 341 | |
| identifier eissn | 1043-7398 | |
| keywords | Failure | |
| keywords | Flip-chip packages | |
| keywords | Stress | |
| keywords | Finite element analysis AND Density | |
| tree | Journal of Electronic Packaging:;1998:;volume( 120 ):;issue: 004 | |
| contenttype | Fulltext | |