| contributor author | S. A. Taylor | |
| contributor author | K. Chen | |
| contributor author | R. Mahajan | |
| date accessioned | 2017-05-08T23:53:13Z | |
| date available | 2017-05-08T23:53:13Z | |
| date copyright | June, 1997 | |
| date issued | 1997 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26160#85_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/118536 | |
| description abstract | Moisture migration in PQFPs (plastic quad flat packages) was investigated analytically and experimentally. Coupons made of the molding compound material were exposed to humid air for an extended time to determine its equilibrium moisture composition as a function of environmental moisture level. An IR (infrared) heating test was designed to simulate the high-temperature heat reflow process when PQFPs are soldered on computer boards. The C-SAM (C-mode Scanning Acoustic Microscopy) technique was employed to measure the delaminated areas. All packages failed after IR heating when the moisture content in PQFPs was higher than 60 percent of the equilibrium composition. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Moisture Migration and Cracking in Plastic Quad Flat Packages (PQFPs) | |
| type | Journal Paper | |
| journal volume | 119 | |
| journal issue | 2 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2792224 | |
| journal fristpage | 85 | |
| journal lastpage | 88 | |
| identifier eissn | 1043-7398 | |
| keywords | Fracture (Process) | |
| keywords | Equilibrium (Physics) | |
| keywords | Heating | |
| keywords | Computers | |
| keywords | Microscopy | |
| keywords | Project tasks | |
| keywords | Heat | |
| keywords | Temperature | |
| keywords | Acoustics | |
| keywords | Lumber AND Molding | |
| tree | Journal of Electronic Packaging:;1997:;volume( 119 ):;issue: 002 | |
| contenttype | Fulltext | |