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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-2 of 2
Two Test Specimens for Determining the Interfacial Fracture Toughness in Flip-Chip Assemblies
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Two test specimens are developed to measure interfacial fracture toughness in flip-chip assemblies. The specimens consist of three layers: silicon chip, underfill, and circuit board. Two symmetric ...
Prediction of Electrical Properties of Plain-Weave Fabric Composites for Printed Wiring Board Design
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A mechanistic model is presented for predicting the effective dielectric constant and loss tangent of woven-fabric reinforced composites with low-loss constituents. A two-scale asymptotic homogenization ...