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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-4 of 4
Editorial
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This issue of the Journal of Electronic Packaging has eight papers selected from the first international conference on thermal issues in emerging technologies theory and applications (ThETA I) ...
Flexible Profile Compact Thermal Models for Practical Geometries
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Recent advances in compact thermal models have led to the emergence of a new concept allowing models to be created at any desired order of accuracy. Traditionally, increasing precision was ...
Editorial
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This issue of the Journal of Electronic Packaging has six papers selected from the second international conference on thermal issues in emerging technologies theory and applications. This conference ...
Compact Thermal Models: A Global Approach
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The construction and usage of compact thermal models (CTMs), for the thermal analysis as well as the design of cooling devices for electronic systems, are reviewed. These models have many ...