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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-6 of 6
On the Use of Micro Heat Pipes as an Integral Part of Semiconductor Devices
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A transient three-dimensional numerical model was developed to determine the potential advantages of constructing an array of very small (100 μm diameter) heat pipes as an integral part of ...
Investigation of a Heat Pipe Array for Convective Cooling
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A combined experimental and analytical investigation was conducted to evaluate a heat pipe convective cooling device consisting of sixteen small copper/water heat pipes mounted vertically in a 4 ...
Steady-State Investigation of Vapor Deposited Micro Heat Pipe Arrays
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An experimental investigation of vapor deposited micro heat pipe arrays was conducted using arrays of 34 and 66 micro heat pipes occupying 0.75 and 1.45 percent of the cross-sectional area, ...
An Experimental Investigation of a High Flux Heat Pipe Heat Sink
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An experimental investigation of a highly efficient heat pipe heat sink was investigated, in which the interline region was optimized using sintered particles. The effects of condenser size, ...
Transient Response Characteristics of Vapor Deposited Micro Heat Pipe Arrays
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The transient thermal response of vapor deposited micro heat pipe arrays fabricated as an integral part of silicon wafers was measured to determine if these arrays could be used to reduce the ...
Forced Convection Heat Transfer Augmentation in a Channel With A Localized Heat Source Using Fibrous Materials
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A numerical model is developed for high Reynolds number forced convection heat transfer in a channel filled with randomly oriented, thin fibrous materials of high porosity. A localized isothermal ...