contributor author | G. P. Peterson | |
contributor author | A. K. Mallik | |
date accessioned | 2017-05-08T23:46:56Z | |
date available | 2017-05-08T23:46:56Z | |
date copyright | March, 1995 | |
date issued | 1995 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26147#82_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/115181 | |
description abstract | The transient thermal response of vapor deposited micro heat pipe arrays fabricated as an integral part of silicon wafers was measured to determine if these arrays could be used to reduce the local temperature gradients and improve the reliability of semiconductor devices. Wafers with arrays of 34 and 66 micro heat pipes were evaluated using an IR thermal imaging system in conjunction with a VHS video recorder. These arrays occupied 0.75 and 1.45 percent, of the wafer cross-sectional area, respectively. The wafers with micro heat pipe arrays demonstrated a 30 to 45 percent reduction in the thermal time constant when compared to that obtained for plain silicon wafers. This reduction in response time was shown to lead to a significant reduction in the maximum wafer temperature, due to the increased effective thermal conductivity caused by the vaporization and condensation occurring in the individual micro heat pipes. The experimental results were then used to validate a transient numerical model, capable of accurately predicting the transient temperature profile and thermal time constant of the wafer/heat pipe combinations. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Transient Response Characteristics of Vapor Deposited Micro Heat Pipe Arrays | |
type | Journal Paper | |
journal volume | 117 | |
journal issue | 1 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.2792072 | |
journal fristpage | 82 | |
journal lastpage | 87 | |
identifier eissn | 1043-7398 | |
keywords | Vapors | |
keywords | Heat pipes | |
keywords | Transients (Dynamics) | |
keywords | Semiconductor wafers | |
keywords | Thermal conductivity | |
keywords | Semiconductor device reliability | |
keywords | Temperature profiles | |
keywords | Imaging | |
keywords | Temperature gradients | |
keywords | Computer simulation | |
keywords | Temperature AND Condensation | |
tree | Journal of Electronic Packaging:;1995:;volume( 117 ):;issue: 001 | |
contenttype | Fulltext | |