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    Investigation of a Heat Pipe Array for Convective Cooling

    Source: Journal of Electronic Packaging:;1995:;volume( 117 ):;issue: 003::page 208
    Author:
    A. H. Howard
    ,
    G. P. Peterson
    DOI: 10.1115/1.2792093
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A combined experimental and analytical investigation was conducted to evaluate a heat pipe convective cooling device consisting of sixteen small copper/water heat pipes mounted vertically in a 4 × 4 array which was 25.4 mm square. The analytical portion of the investigation focused on determination of the maximum heat transport capacity and the resistance of the individual heat pipes. The resistance of each heat pipe was found to be 2.51 K/Watt, or more than 3 times smaller than the resistance produced by a solid copper rod with the same dimensions. The maximum predicted heat rejection for the module was over 50 Watts, or a power density in excess of 7.75 Watts/cm2 . In the experimental portion of the investigation, two different modules were tested. The first module utilized ten circular aluminum fins mounted on the condenser end of each heat pipe to enhance heat rejection, while the second contained only the sixteen copper/water heat pipes. The effects of flow velocity, input power, and base plate temperature on the overall thermal resistance and the heat rejection capacity were determined, as well as the pressure drop resulting from each module. The finned heat pipe array was found to have a lower overall thermal resistance and thus, a higher heat rejection capacity, but also resulted in a significantly larger pressure drop than the array without fins. The results of the heat pipe array experiments were also compared with experimental and empirical results obtained from flow over a flat plate 25.4 mm square.
    keyword(s): Cooling , Heat pipes , Heat , Copper , Electrical resistance , Pressure drop , Thermal resistance , Water , Fins , Electrical measurement , Flow (Dynamics) , Density , Temperature , Dimensions , Aluminum , Flat plates AND Condensers (steam plant) ,
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      Investigation of a Heat Pipe Array for Convective Cooling

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/115143
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    • Journal of Electronic Packaging

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    contributor authorA. H. Howard
    contributor authorG. P. Peterson
    date accessioned2017-05-08T23:46:54Z
    date available2017-05-08T23:46:54Z
    date copyrightSeptember, 1995
    date issued1995
    identifier issn1528-9044
    identifier otherJEPAE4-26150#208_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/115143
    description abstractA combined experimental and analytical investigation was conducted to evaluate a heat pipe convective cooling device consisting of sixteen small copper/water heat pipes mounted vertically in a 4 × 4 array which was 25.4 mm square. The analytical portion of the investigation focused on determination of the maximum heat transport capacity and the resistance of the individual heat pipes. The resistance of each heat pipe was found to be 2.51 K/Watt, or more than 3 times smaller than the resistance produced by a solid copper rod with the same dimensions. The maximum predicted heat rejection for the module was over 50 Watts, or a power density in excess of 7.75 Watts/cm2 . In the experimental portion of the investigation, two different modules were tested. The first module utilized ten circular aluminum fins mounted on the condenser end of each heat pipe to enhance heat rejection, while the second contained only the sixteen copper/water heat pipes. The effects of flow velocity, input power, and base plate temperature on the overall thermal resistance and the heat rejection capacity were determined, as well as the pressure drop resulting from each module. The finned heat pipe array was found to have a lower overall thermal resistance and thus, a higher heat rejection capacity, but also resulted in a significantly larger pressure drop than the array without fins. The results of the heat pipe array experiments were also compared with experimental and empirical results obtained from flow over a flat plate 25.4 mm square.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleInvestigation of a Heat Pipe Array for Convective Cooling
    typeJournal Paper
    journal volume117
    journal issue3
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2792093
    journal fristpage208
    journal lastpage214
    identifier eissn1043-7398
    keywordsCooling
    keywordsHeat pipes
    keywordsHeat
    keywordsCopper
    keywordsElectrical resistance
    keywordsPressure drop
    keywordsThermal resistance
    keywordsWater
    keywordsFins
    keywordsElectrical measurement
    keywordsFlow (Dynamics)
    keywordsDensity
    keywordsTemperature
    keywordsDimensions
    keywordsAluminum
    keywordsFlat plates AND Condensers (steam plant)
    treeJournal of Electronic Packaging:;1995:;volume( 117 ):;issue: 003
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
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