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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-3 of 3
Liquid Immersion Cooling of a Longitudinal Array of Discrete Heat Sources in Protruding Substrates: I—Single-Phase Convection
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Experiments have been performed using water and FC-77 to investigate heat transfer from an in-line 1 x 10 array of discrete heat sources, flush mounted to protruding substrates located on the ...
Liquid Immersion Cooling of a Longitudinal Array of Discrete Heat Sources in Protruding Substrates: II—Forced Convection Boiling
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Forced convection boiling experiments have been performed for an in-line 1 x 10 array of discrete heat sources, flush mounted to protruding substrates located on the bottom wall of a horizontal ...
Planar Liquid Jet Impingement Cooling of Multiple Discrete Heat Sources
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Average heat transfer measurements have been made for discrete heat sources located under a liquid jet issuing from a rectangular slot. The heat sources were flush mounted in a plane wall of ...