YaBeSH Engineering and Technology Library

    • Journals
    • PaperQuest
    • YSE Standards
    • YaBeSH
    • Login
    View Item 
    •   YE&T Library
    • ASME
    • Journal of Electronic Packaging
    • View Item
    •   YE&T Library
    • ASME
    • Journal of Electronic Packaging
    • View Item
    • All Fields
    • Source Title
    • Year
    • Publisher
    • Title
    • Subject
    • Author
    • DOI
    • ISBN
    Advanced Search
    JavaScript is disabled for your browser. Some features of this site may not work without it.

    Archive

    Liquid Immersion Cooling of a Longitudinal Array of Discrete Heat Sources in Protruding Substrates: II—Forced Convection Boiling

    Source: Journal of Electronic Packaging:;1992:;volume( 114 ):;issue: 001::page 63
    Author:
    T. J. Heindel
    ,
    S. Ramadhyani
    ,
    F. P. Incropera
    DOI: 10.1115/1.2905443
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Forced convection boiling experiments have been performed for an in-line 1 x 10 array of discrete heat sources, flush mounted to protruding substrates located on the bottom wall of a horizontal flow channel. FC-72, a dielectric fluorocarbon liquid, was used as the heat transfer fluid, and the experiments covered a range of flow velocities, degrees of fluid subcooling, and channel heights. The maximum heater-to-heater surface temperature variation was less than 2.5°C and was insensitive to channel height under conditions of fully developed nucleate boiling. Although the fluid velocity influenced the heat flux for partially developed nucleate boiling, its influence was muted for fully developed nucleate boiling. The heat flux associated with a departure from nucleate boiling increased with increasing velocity, subcooling, and channel height; however, the effect of channel height was only significant when all of the upstream heaters were energized.
    keyword(s): Heat , Cooling , Boiling , Forced convection , Channels (Hydraulic engineering) , Nucleate boiling , Fluids , Flow (Dynamics) , Subcooling , Heat flux , Temperature AND Heat transfer ,
    • Download: (981.6Kb)
    • Show Full MetaData Hide Full MetaData
    • Get RIS
    • Item Order
    • Go To Publisher
    • Price: 5000 Rial
    • Statistics

      Liquid Immersion Cooling of a Longitudinal Array of Discrete Heat Sources in Protruding Substrates: II—Forced Convection Boiling

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/110097
    Collections
    • Journal of Electronic Packaging

    Show full item record

    contributor authorT. J. Heindel
    contributor authorS. Ramadhyani
    contributor authorF. P. Incropera
    date accessioned2017-05-08T23:38:10Z
    date available2017-05-08T23:38:10Z
    date copyrightMarch, 1992
    date issued1992
    identifier issn1528-9044
    identifier otherJEPAE4-26127#63_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/110097
    description abstractForced convection boiling experiments have been performed for an in-line 1 x 10 array of discrete heat sources, flush mounted to protruding substrates located on the bottom wall of a horizontal flow channel. FC-72, a dielectric fluorocarbon liquid, was used as the heat transfer fluid, and the experiments covered a range of flow velocities, degrees of fluid subcooling, and channel heights. The maximum heater-to-heater surface temperature variation was less than 2.5°C and was insensitive to channel height under conditions of fully developed nucleate boiling. Although the fluid velocity influenced the heat flux for partially developed nucleate boiling, its influence was muted for fully developed nucleate boiling. The heat flux associated with a departure from nucleate boiling increased with increasing velocity, subcooling, and channel height; however, the effect of channel height was only significant when all of the upstream heaters were energized.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleLiquid Immersion Cooling of a Longitudinal Array of Discrete Heat Sources in Protruding Substrates: II—Forced Convection Boiling
    typeJournal Paper
    journal volume114
    journal issue1
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2905443
    journal fristpage63
    journal lastpage70
    identifier eissn1043-7398
    keywordsHeat
    keywordsCooling
    keywordsBoiling
    keywordsForced convection
    keywordsChannels (Hydraulic engineering)
    keywordsNucleate boiling
    keywordsFluids
    keywordsFlow (Dynamics)
    keywordsSubcooling
    keywordsHeat flux
    keywordsTemperature AND Heat transfer
    treeJournal of Electronic Packaging:;1992:;volume( 114 ):;issue: 001
    contenttypeFulltext
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian
     
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian