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    Planar Liquid Jet Impingement Cooling of Multiple Discrete Heat Sources

    Source: Journal of Electronic Packaging:;1991:;volume( 113 ):;issue: 004::page 359
    Author:
    D. Schafer
    ,
    F. P. Incropera
    ,
    S. Ramadhyani
    DOI: 10.1115/1.2905421
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Average heat transfer measurements have been made for discrete heat sources located under a liquid jet issuing from a rectangular slot. The heat sources were flush mounted in a plane wall of low thermal conductivity, while the jet emanated from a slot in the opposite wall. The two walls formed a plane channel which simulated a multichip module cooled by direct liquid immersion. Heaters were positioned directly below the jet, as well as at locations offset from the jet midplane. The measurements revealed a secondary peak in the heat transfer coefficient at an offset of approximately four jet widths, and the magnitude of the secondary peak increased with increasing Reynolds number. Depending on Reynolds number, the secondary peak may be due to formation of a recirculation zone and/or to boundary layer transition. The effect of separation distance between the nozzle and the impingement plate was small for the conditions of the study, as was the effect of upstream heating on heat sources located near the stagnation line of the jet. The effect of the outflow manifold location was also found to be negligible, except when it was positioned directly over a heater.
    keyword(s): Heat , Impingement cooling , Measurement , Reynolds number , Thermal conductivity , Boundary layers , Heat transfer , Separation (Technology) , Channels (Hydraulic engineering) , Nozzles , Manifolds , Heating , Heat transfer coefficients , Multi-chip modules AND Outflow ,
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      Planar Liquid Jet Impingement Cooling of Multiple Discrete Heat Sources

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    http://yetl.yabesh.ir/yetl1/handle/yetl/108353
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    contributor authorD. Schafer
    contributor authorF. P. Incropera
    contributor authorS. Ramadhyani
    date accessioned2017-05-08T23:35:11Z
    date available2017-05-08T23:35:11Z
    date copyrightDecember, 1991
    date issued1991
    identifier issn1528-9044
    identifier otherJEPAE4-26124#359_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/108353
    description abstractAverage heat transfer measurements have been made for discrete heat sources located under a liquid jet issuing from a rectangular slot. The heat sources were flush mounted in a plane wall of low thermal conductivity, while the jet emanated from a slot in the opposite wall. The two walls formed a plane channel which simulated a multichip module cooled by direct liquid immersion. Heaters were positioned directly below the jet, as well as at locations offset from the jet midplane. The measurements revealed a secondary peak in the heat transfer coefficient at an offset of approximately four jet widths, and the magnitude of the secondary peak increased with increasing Reynolds number. Depending on Reynolds number, the secondary peak may be due to formation of a recirculation zone and/or to boundary layer transition. The effect of separation distance between the nozzle and the impingement plate was small for the conditions of the study, as was the effect of upstream heating on heat sources located near the stagnation line of the jet. The effect of the outflow manifold location was also found to be negligible, except when it was positioned directly over a heater.
    publisherThe American Society of Mechanical Engineers (ASME)
    titlePlanar Liquid Jet Impingement Cooling of Multiple Discrete Heat Sources
    typeJournal Paper
    journal volume113
    journal issue4
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2905421
    journal fristpage359
    journal lastpage366
    identifier eissn1043-7398
    keywordsHeat
    keywordsImpingement cooling
    keywordsMeasurement
    keywordsReynolds number
    keywordsThermal conductivity
    keywordsBoundary layers
    keywordsHeat transfer
    keywordsSeparation (Technology)
    keywordsChannels (Hydraulic engineering)
    keywordsNozzles
    keywordsManifolds
    keywordsHeating
    keywordsHeat transfer coefficients
    keywordsMulti-chip modules AND Outflow
    treeJournal of Electronic Packaging:;1991:;volume( 113 ):;issue: 004
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
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