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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-4 of 4
Constitutive Behavior and Low Cycle Thermal Fatigue of 97Sn-3Cu Solder Joints
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The thermal cyclic shear stress/strain hysteresis response and associated steady-state creep parameters of 97Sn-3Cu solder joints have been determined using a beam specimen previously developed by ...
Thermal Fatigue Damage in the Solder Joints of Leadless Chip Resistors
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Leadless chip resistors (LCR) made by two different manufacturers and surface mounted on glass/epoxy printed circuit board (PCB) were subjected to thermal cycling between −55°C to 125°C ...
Development of an Integrated Design System for Thermal Reliability Prediction of SMT Solder Interconnects
Publisher: The American Society of Mechanical Engineers (ASME)
Determination of Fracture Toughness of Thermally Conductive Adhesives
Publisher: The American Society of Mechanical Engineers (ASME)