Determination of Fracture Toughness of Thermally Conductive AdhesivesSource: Journal of Electronic Packaging:;1997:;volume( 119 ):;issue: 003::page 204DOI: 10.1115/1.2792235Publisher: The American Society of Mechanical Engineers (ASME)keyword(s): Adhesives AND Fracture toughness ,
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| contributor author | E. Jih | |
| contributor author | X. Song | |
| contributor author | C. Larner | |
| contributor author | Y.-H. Pao | |
| date accessioned | 2017-05-08T23:53:12Z | |
| date available | 2017-05-08T23:53:12Z | |
| date copyright | September, 1997 | |
| date issued | 1997 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26161#204_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/118530 | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Determination of Fracture Toughness of Thermally Conductive Adhesives | |
| type | Journal Paper | |
| journal volume | 119 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2792235 | |
| journal fristpage | 204 | |
| journal lastpage | 207 | |
| identifier eissn | 1043-7398 | |
| keywords | Adhesives AND Fracture toughness | |
| tree | Journal of Electronic Packaging:;1997:;volume( 119 ):;issue: 003 | |
| contenttype | Fulltext |