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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-3 of 3
Failure Analysis of No-Clean and Water-Clean Solder Joints 0.4 mm Pitch, 256-Pin Plastic Quad Flat Pack
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Printed circuit boards populated with twenty-five 0.4 mm pitch, 256-pin plastic quad flat packs (QFP) containing no-clean and water-clean solder joints were subjected to thermal cycling in order ...
Thermal Fatigue Damage in the Solder Joints of Leadless Chip Resistors
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Leadless chip resistors (LCR) made by two different manufacturers and surface mounted on glass/epoxy printed circuit board (PCB) were subjected to thermal cycling between −55°C to 125°C ...
Determination of Fracture Toughness of Thermally Conductive Adhesives
Publisher: The American Society of Mechanical Engineers (ASME)