Recent Advances and New Trends in Flip Chip TechnologySource: Journal of Electronic Packaging:;2016:;volume( 138 ):;issue: 003::page 30802Author:Lau, John H.
DOI: 10.1115/1.4034037Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Recent advances in flip chip technology such as wafer bumping, package substrate, flip chip assembly, and underfill will be presented in this study. Emphasis is placed on the latest developments of these areas in the past few years. Their future trends will also be recommended.
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| contributor author | Lau, John H. | |
| date accessioned | 2017-05-09T01:27:33Z | |
| date available | 2017-05-09T01:27:33Z | |
| date issued | 2016 | |
| identifier issn | 1528-9044 | |
| identifier other | ep_138_03_030802.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/160829 | |
| description abstract | Recent advances in flip chip technology such as wafer bumping, package substrate, flip chip assembly, and underfill will be presented in this study. Emphasis is placed on the latest developments of these areas in the past few years. Their future trends will also be recommended. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Recent Advances and New Trends in Flip Chip Technology | |
| type | Journal Paper | |
| journal volume | 138 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.4034037 | |
| journal fristpage | 30802 | |
| journal lastpage | 30802 | |
| identifier eissn | 1043-7398 | |
| tree | Journal of Electronic Packaging:;2016:;volume( 138 ):;issue: 003 | |
| contenttype | Fulltext |