Decomposable and Template Polymers: Fundamentals and ApplicationsSource: Journal of Electronic Packaging:;2016:;volume( 138 ):;issue: 002::page 20802DOI: 10.1115/1.4033000Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Polymers can be used as temporary place holders in the fabrication of embedded air gaps in a variety of electronic devices. Embedded air cavities can provide the lowest dielectric constant and loss for electrical insulation, mechanical compliance in devices where lowforce deformations are desirable, and can temporarily protect movable parts during processing. Several families of polymers have been used as sacrificial, templating polymers including polycarbonates, polynorbornenes (PNBs), and polyaldehydes. The families can be distinguished by chemical structure and decomposition temperature. The decomposition temperature ranges from over 400 آ°C to below room temperature in the case of low ceiling temperature polymers. Overcoat materials include silicon dioxide, polyimides, epoxy, and bisbenzocyclobutene (BCB). The methods of airgap fabrication are discussed. Finally, the use of photoactive compounds in the patterning of the sacrificial polymers is reviewed.
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contributor author | Uzunlar, Erdal | |
contributor author | Schwartz, Jared | |
contributor author | Phillips, Oluwadamilola | |
contributor author | Kohl, Paul A. | |
date accessioned | 2017-05-09T01:27:29Z | |
date available | 2017-05-09T01:27:29Z | |
date issued | 2016 | |
identifier issn | 1528-9044 | |
identifier other | ep_138_02_020802.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/160812 | |
description abstract | Polymers can be used as temporary place holders in the fabrication of embedded air gaps in a variety of electronic devices. Embedded air cavities can provide the lowest dielectric constant and loss for electrical insulation, mechanical compliance in devices where lowforce deformations are desirable, and can temporarily protect movable parts during processing. Several families of polymers have been used as sacrificial, templating polymers including polycarbonates, polynorbornenes (PNBs), and polyaldehydes. The families can be distinguished by chemical structure and decomposition temperature. The decomposition temperature ranges from over 400 آ°C to below room temperature in the case of low ceiling temperature polymers. Overcoat materials include silicon dioxide, polyimides, epoxy, and bisbenzocyclobutene (BCB). The methods of airgap fabrication are discussed. Finally, the use of photoactive compounds in the patterning of the sacrificial polymers is reviewed. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Decomposable and Template Polymers: Fundamentals and Applications | |
type | Journal Paper | |
journal volume | 138 | |
journal issue | 2 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.4033000 | |
journal fristpage | 20802 | |
journal lastpage | 20802 | |
identifier eissn | 1043-7398 | |
tree | Journal of Electronic Packaging:;2016:;volume( 138 ):;issue: 002 | |
contenttype | Fulltext |