| contributor author | Tan, Yansong | |
| contributor author | Li, Xin | |
| contributor author | Mei, Yunhui | |
| contributor author | Chen, Gang | |
| contributor author | Chen, Xu | |
| date accessioned | 2017-05-09T01:27:28Z | |
| date available | 2017-05-09T01:27:28Z | |
| date issued | 2016 | |
| identifier issn | 1528-9044 | |
| identifier other | ep_138_02_021001.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/160807 | |
| description abstract | A series of dwellfatigue tests were conducted on nanosilver sintered lap shear joint at elevated temperatures from 125 آ°C to 325 آ°C. The effects of temperature and loading conditions on dwellfatigue behavior of nanosilver sintered lap shear joint were systematically studied. With higher temperature and longer dwell time, creep played a more important part in dwellfatigue tests. Creep strain accumulated during maximum shear stress hold was found partly recovered by the subsequent cyclic unloading. Both the fracture mode and silver particle growth pattern were characterized by Xray tomography system and scanning electron microscope (SEM). The mean shear strain rate خ³ث™m synthesized the effects of various factors, such as temperature, shear stress amplitude, mean shear stress, and dwell time, by which the fatigue and dwellfatigue life of nanosilver sintered lap shear joint could be well predicted within a factor of two. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Temperature Dependent Dwell Fatigue Behavior of Nanosilver Sintered Lap Shear Joint | |
| type | Journal Paper | |
| journal volume | 138 | |
| journal issue | 2 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.4032880 | |
| journal fristpage | 21001 | |
| journal lastpage | 21001 | |
| identifier eissn | 1043-7398 | |
| tree | Journal of Electronic Packaging:;2016:;volume( 138 ):;issue: 002 | |
| contenttype | Fulltext | |