Special Section on InterPACK 2015Source: Journal of Electronic Packaging:;2016:;volume( 138 ):;issue: 001::page 10201Author:Chaparala, Satish
,
Gupta, Ashish
,
Asheghi, Mehdi
,
Suhling, Jeffrey
,
Ikeda, Toru
,
Luo, Xiaobing
DOI: 10.1115/1.4032748Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: InterPACK 2015, the flagship conference of the ASME Electronic and Photonic Packaging Division held on July 6–9, 2015 in San Francisco, CA, is the premier international forum for the exchange of stateoftheart knowledge in research, development, manufacturing, and applications of electronic packaging, MEMS, and NEMS. This is the first time that the InterPACK has been held jointly with the International Conference on Nanochannels, Microchannels, and Minichannels (ICNMM). Jointly organized and held, there was an outstanding technical program featuring more than 600 technical presentations in nine technical tracks. The Technical Track Committees comprise leading researchers and engineers from industrial companies, government laboratories, and academic institutions throughout the world. The nine tracks are: (1) Advanced Electronics and Photonics: Packaging, Interconnect, and Reliability, (2) Emerging Technology Frontiers, (3) MEMS and NEMS, (4) Thermal Management, (5) Thermal Management Using Microchannels, Jets, and Sprays, (6) Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Miniscales, (7) Advanced Fabrication and Manufacturing, (8) Energy, Health, and WaterApplications of Nano, Micro, and Miniscale Devices, and (9) Advanced Electronics and Photonics, Packaging Materials, and Processing. At the end of the conference, each track chair was invited to recommend two papers from their track for this special section. All the recommended papers are again reviewed and some of them are selected for publication in this special section.
|
Collections
Show full item record
contributor author | Chaparala, Satish | |
contributor author | Gupta, Ashish | |
contributor author | Asheghi, Mehdi | |
contributor author | Suhling, Jeffrey | |
contributor author | Ikeda, Toru | |
contributor author | Luo, Xiaobing | |
date accessioned | 2017-05-09T01:27:27Z | |
date available | 2017-05-09T01:27:27Z | |
date issued | 2016 | |
identifier issn | 1528-9044 | |
identifier other | ep_138_01_010201.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/160806 | |
description abstract | InterPACK 2015, the flagship conference of the ASME Electronic and Photonic Packaging Division held on July 6–9, 2015 in San Francisco, CA, is the premier international forum for the exchange of stateoftheart knowledge in research, development, manufacturing, and applications of electronic packaging, MEMS, and NEMS. This is the first time that the InterPACK has been held jointly with the International Conference on Nanochannels, Microchannels, and Minichannels (ICNMM). Jointly organized and held, there was an outstanding technical program featuring more than 600 technical presentations in nine technical tracks. The Technical Track Committees comprise leading researchers and engineers from industrial companies, government laboratories, and academic institutions throughout the world. The nine tracks are: (1) Advanced Electronics and Photonics: Packaging, Interconnect, and Reliability, (2) Emerging Technology Frontiers, (3) MEMS and NEMS, (4) Thermal Management, (5) Thermal Management Using Microchannels, Jets, and Sprays, (6) Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Miniscales, (7) Advanced Fabrication and Manufacturing, (8) Energy, Health, and WaterApplications of Nano, Micro, and Miniscale Devices, and (9) Advanced Electronics and Photonics, Packaging Materials, and Processing. At the end of the conference, each track chair was invited to recommend two papers from their track for this special section. All the recommended papers are again reviewed and some of them are selected for publication in this special section. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Special Section on InterPACK 2015 | |
type | Journal Paper | |
journal volume | 138 | |
journal issue | 1 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.4032748 | |
journal fristpage | 10201 | |
journal lastpage | 10201 | |
identifier eissn | 1043-7398 | |
tree | Journal of Electronic Packaging:;2016:;volume( 138 ):;issue: 001 | |
contenttype | Fulltext |