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    A Holistic Evaluation of Data Center Water Cooling Total Cost of Ownership

    Source: Journal of Electronic Packaging:;2016:;volume( 138 ):;issue: 001::page 10912
    Author:
    Demetriou, Dustin W.
    ,
    Kamath, Vinod
    ,
    Mahaney, Howard
    DOI: 10.1115/1.4032494
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The generationtogeneration information technology (IT) performance and density demands continue to drive innovation in data center cooling technologies. For many applications, the ability to efficiently deliver cooling via traditional chilled air cooling approaches has become inadequate. Water cooling has been used in data centers for more than 50 years to improve heat dissipation, boost performance, and increase efficiency. While water cooling can undoubtedly have a higher initial capital cost, water cooling can be very cost effective when looking at the true life cycle cost of a watercooled data center. This study aims at addressing how one should evaluate the true total cost of ownership (TCO) for watercooled data centers by considering the combined capital and operational cost for both the IT systems and the data center facility. It compares several metrics, including returnoninvestment for three cooling technologies: traditional air cooling, racklevel cooling using rear door heat exchangers, and direct water cooling (DWC) via cold plates. The results highlight several important variables, namely, IT power, data center location, site electric utility cost, and construction costs and how each of these influences the TCO of water cooling. The study further looks at implementing water cooling as part of a new data center construction project versus a retrofit or upgrade into an existing data center facility.
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      A Holistic Evaluation of Data Center Water Cooling Total Cost of Ownership

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    http://yetl.yabesh.ir/yetl1/handle/yetl/160799
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    contributor authorDemetriou, Dustin W.
    contributor authorKamath, Vinod
    contributor authorMahaney, Howard
    date accessioned2017-05-09T01:27:26Z
    date available2017-05-09T01:27:26Z
    date issued2016
    identifier issn1528-9044
    identifier otherep_138_01_010912.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/160799
    description abstractThe generationtogeneration information technology (IT) performance and density demands continue to drive innovation in data center cooling technologies. For many applications, the ability to efficiently deliver cooling via traditional chilled air cooling approaches has become inadequate. Water cooling has been used in data centers for more than 50 years to improve heat dissipation, boost performance, and increase efficiency. While water cooling can undoubtedly have a higher initial capital cost, water cooling can be very cost effective when looking at the true life cycle cost of a watercooled data center. This study aims at addressing how one should evaluate the true total cost of ownership (TCO) for watercooled data centers by considering the combined capital and operational cost for both the IT systems and the data center facility. It compares several metrics, including returnoninvestment for three cooling technologies: traditional air cooling, racklevel cooling using rear door heat exchangers, and direct water cooling (DWC) via cold plates. The results highlight several important variables, namely, IT power, data center location, site electric utility cost, and construction costs and how each of these influences the TCO of water cooling. The study further looks at implementing water cooling as part of a new data center construction project versus a retrofit or upgrade into an existing data center facility.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleA Holistic Evaluation of Data Center Water Cooling Total Cost of Ownership
    typeJournal Paper
    journal volume138
    journal issue1
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.4032494
    journal fristpage10912
    journal lastpage10912
    identifier eissn1043-7398
    treeJournal of Electronic Packaging:;2016:;volume( 138 ):;issue: 001
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian