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    Dynamic Numerical Microchannel Evaporator Model to Investigate Parallel Channel Instabilities

    Source: Journal of Electronic Packaging:;2016:;volume( 138 ):;issue: 001::page 10901
    Author:
    Saenen, Tom
    ,
    Thome, John R.
    DOI: 10.1115/1.4032490
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A fully dynamic model of a microchannel evaporator is presented. The aim of the model is to study the highly dynamic parallel channel instabilities that occur in these evaporators in more detail. The numerical solver for the model is custombuilt and the majority of the paper is focused on detailing the various aspects of this solver. The onedimensional homogeneous twophase flow conservation equations are solved to simulate the flow. The full threedimensional (3D) conduction domain of the evaporator is also dynamically resolved. This allows for the correct simulation of the complex hydraulic and thermal interactions between the microchannels that give rise to the parallel channel instabilities. The model uses stateoftheart correlations to calculate the frictional pressure losses and heat transfer in the microchannels. In addition, a model for inlet restrictions is also included to simulate the stabilizing effect of these components. In the final part of the paper, validation results of the model are presented, in which the stability results of the model are compared with the existing experimental data from the literature. Next, a parametric study is performed focusing on the stabilizing effects of the solid substrate properties. It is found that increasing the thermal conductivity and thickness of the solid substrate has a strong stabilizing effect, while increasing the number of microchannels has a small destabilizing effect. Finally, representative dynamic results are also given to demonstrate some of the unique capabilities of the model.
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      Dynamic Numerical Microchannel Evaporator Model to Investigate Parallel Channel Instabilities

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    http://yetl.yabesh.ir/yetl1/handle/yetl/160796
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    contributor authorSaenen, Tom
    contributor authorThome, John R.
    date accessioned2017-05-09T01:27:25Z
    date available2017-05-09T01:27:25Z
    date issued2016
    identifier issn1528-9044
    identifier otherep_138_01_010901.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/160796
    description abstractA fully dynamic model of a microchannel evaporator is presented. The aim of the model is to study the highly dynamic parallel channel instabilities that occur in these evaporators in more detail. The numerical solver for the model is custombuilt and the majority of the paper is focused on detailing the various aspects of this solver. The onedimensional homogeneous twophase flow conservation equations are solved to simulate the flow. The full threedimensional (3D) conduction domain of the evaporator is also dynamically resolved. This allows for the correct simulation of the complex hydraulic and thermal interactions between the microchannels that give rise to the parallel channel instabilities. The model uses stateoftheart correlations to calculate the frictional pressure losses and heat transfer in the microchannels. In addition, a model for inlet restrictions is also included to simulate the stabilizing effect of these components. In the final part of the paper, validation results of the model are presented, in which the stability results of the model are compared with the existing experimental data from the literature. Next, a parametric study is performed focusing on the stabilizing effects of the solid substrate properties. It is found that increasing the thermal conductivity and thickness of the solid substrate has a strong stabilizing effect, while increasing the number of microchannels has a small destabilizing effect. Finally, representative dynamic results are also given to demonstrate some of the unique capabilities of the model.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleDynamic Numerical Microchannel Evaporator Model to Investigate Parallel Channel Instabilities
    typeJournal Paper
    journal volume138
    journal issue1
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.4032490
    journal fristpage10901
    journal lastpage10901
    identifier eissn1043-7398
    treeJournal of Electronic Packaging:;2016:;volume( 138 ):;issue: 001
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian