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    Impact Isolation Through the Use of Compliant Interconnects for Microelectronic Packages

    Source: Journal of Electronic Packaging:;2015:;volume( 137 ):;issue: 004::page 41005
    Author:
    Chen, Wei
    ,
    Bhat, Anirudh
    ,
    Sitaraman, Suresh K.
    DOI: 10.1115/1.4031680
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Firstlevel and secondlevel compliant interconnect structures are being pursued in universities and industries to accommodate the differential displacement induced by the coefficient of thermal expansion mismatch between the die and the substrate or between the substrate and the board. The compliant interconnects mechanically decouple the die from the substrate or the substrate from the board, and thus reduce the thermally induced stresses in the assembly. This paper presents droptest experimental and simulation data for scaledup prototype of compliant interconnects. The simulations were based on InputG method and performed using ANSYSآ® finite element software for varying drop heights. In parallel to the simulations, scaledup compliant polymer interconnects sandwiched between a polymer die and a polymer substrate were fabricated using threedimensional (3D) printing, and this fabrication provides a quick lowcost alternative to cleanroom fabrication. The prototype of the assembly was subjected to drop tests from varying drop heights. The response of the assembly during drop testing was captured using strain gauges and an accelerometer mounted on the prototype. The data from the experiments were compared with the predictions from the simulations. Based on such simulations, significant insight into the behavior of compliant interconnects under impact loading was obtained, which could be used for reliable design of compliant interconnect under impact loading. Both the experimental and simulation data reveal that the compliant interconnects are able to reduce the strains that transfer from substrate to die by oneorder.
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      Impact Isolation Through the Use of Compliant Interconnects for Microelectronic Packages

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    contributor authorChen, Wei
    contributor authorBhat, Anirudh
    contributor authorSitaraman, Suresh K.
    date accessioned2017-05-09T01:17:05Z
    date available2017-05-09T01:17:05Z
    date issued2015
    identifier issn1528-9044
    identifier otherep_137_04_041005.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/157716
    description abstractFirstlevel and secondlevel compliant interconnect structures are being pursued in universities and industries to accommodate the differential displacement induced by the coefficient of thermal expansion mismatch between the die and the substrate or between the substrate and the board. The compliant interconnects mechanically decouple the die from the substrate or the substrate from the board, and thus reduce the thermally induced stresses in the assembly. This paper presents droptest experimental and simulation data for scaledup prototype of compliant interconnects. The simulations were based on InputG method and performed using ANSYSآ® finite element software for varying drop heights. In parallel to the simulations, scaledup compliant polymer interconnects sandwiched between a polymer die and a polymer substrate were fabricated using threedimensional (3D) printing, and this fabrication provides a quick lowcost alternative to cleanroom fabrication. The prototype of the assembly was subjected to drop tests from varying drop heights. The response of the assembly during drop testing was captured using strain gauges and an accelerometer mounted on the prototype. The data from the experiments were compared with the predictions from the simulations. Based on such simulations, significant insight into the behavior of compliant interconnects under impact loading was obtained, which could be used for reliable design of compliant interconnect under impact loading. Both the experimental and simulation data reveal that the compliant interconnects are able to reduce the strains that transfer from substrate to die by oneorder.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleImpact Isolation Through the Use of Compliant Interconnects for Microelectronic Packages
    typeJournal Paper
    journal volume137
    journal issue4
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.4031680
    journal fristpage41005
    journal lastpage41005
    identifier eissn1043-7398
    treeJournal of Electronic Packaging:;2015:;volume( 137 ):;issue: 004
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
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