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    Void Detection in Dielectric Films Using a Floating Network of Substrate Embedded Electrodes

    Source: Journal of Electronic Packaging:;2014:;volume( 136 ):;issue: 004::page 41007
    Author:
    Taylor, Stephen H.
    ,
    Garimella, Suresh V.
    DOI: 10.1115/1.4028075
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A sensor is developed for simple, in situ characterization of dielectric thermal interface materials (TIMs) at bond line thicknesses less than 100 خ¼m. The working principle is based on the detection of regions of contrasting electric permittivity. An array of long, parallel electrodes is flushmounted into each opposing substrate face of a narrow gap interface, and exposed to the gap formed between the two surfaces. Electrodes are oriented such that their lengthwise dimension in one substrate runs perpendicular to those in the other. A capacitance measurement taken between opposing electrodes is used to characterize the interface region in the vicinity of their crossing point (junction). The electric field associated with each electrode junction is numerically simulated and analyzed. Criteria are developed for the design of electrode junction geometries that localize the electric fields. The capacitances between floatingground electrodes in the electrode sensor configuration employed give rise to a nontrivial network of interacting capacitances which strongly influence the measured response at any junction. A generalized solution for analyzing the floating network response is presented. The technique is used to experimentally detect thermal grease spots of 0.2 mm to 1.8 mm diameter within a 25 خ¼m interface gap. It is necessary to use the generalized solution to the capacitance network developed in this work to properly delineate regions of contrasting permittivity in the interface gap region using capacitance measurements.
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      Void Detection in Dielectric Films Using a Floating Network of Substrate Embedded Electrodes

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    http://yetl.yabesh.ir/yetl1/handle/yetl/154499
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    contributor authorTaylor, Stephen H.
    contributor authorGarimella, Suresh V.
    date accessioned2017-05-09T01:06:53Z
    date available2017-05-09T01:06:53Z
    date issued2014
    identifier issn1528-9044
    identifier otherep_136_04_041007.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/154499
    description abstractA sensor is developed for simple, in situ characterization of dielectric thermal interface materials (TIMs) at bond line thicknesses less than 100 خ¼m. The working principle is based on the detection of regions of contrasting electric permittivity. An array of long, parallel electrodes is flushmounted into each opposing substrate face of a narrow gap interface, and exposed to the gap formed between the two surfaces. Electrodes are oriented such that their lengthwise dimension in one substrate runs perpendicular to those in the other. A capacitance measurement taken between opposing electrodes is used to characterize the interface region in the vicinity of their crossing point (junction). The electric field associated with each electrode junction is numerically simulated and analyzed. Criteria are developed for the design of electrode junction geometries that localize the electric fields. The capacitances between floatingground electrodes in the electrode sensor configuration employed give rise to a nontrivial network of interacting capacitances which strongly influence the measured response at any junction. A generalized solution for analyzing the floating network response is presented. The technique is used to experimentally detect thermal grease spots of 0.2 mm to 1.8 mm diameter within a 25 خ¼m interface gap. It is necessary to use the generalized solution to the capacitance network developed in this work to properly delineate regions of contrasting permittivity in the interface gap region using capacitance measurements.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleVoid Detection in Dielectric Films Using a Floating Network of Substrate Embedded Electrodes
    typeJournal Paper
    journal volume136
    journal issue4
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.4028075
    journal fristpage41007
    journal lastpage41007
    identifier eissn1043-7398
    treeJournal of Electronic Packaging:;2014:;volume( 136 ):;issue: 004
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian