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    Determination of the Lumped Capacitance Parameters of Air Cooled Servers Through Air Temperature Measurements

    Source: Journal of Electronic Packaging:;2014:;volume( 136 ):;issue: 003::page 31005
    Author:
    Salih Erden, Hamza
    ,
    Ezzat Khalifa, H.
    ,
    Schmidt, Roger R.
    DOI: 10.1115/1.4027092
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Computer servers can be represented by lumped thermal capacitances for the purpose of simulating server and data center transient thermal response to changes in operating conditions or equipment failures. Two parameters are needed to characterize the transient behavior of a lumpedcapacitance server: its thermal capacitance and its thermal conductance, heat transfer effectiveness, or time constant. To avoid the laborious task of obtaining these parameters from measurements or estimations of the thermal characteristics of internal components of the server, a method is proposed to derive these parameters from external measurements that can be easily obtained without performing an “autopsyâ€‌ on the server. In this paper, we present the mathematical formulation underlying the proposed method and describe how the parameters are to be obtained from external airtemperature measurements using the mathematical model. We then present validation test cases using experimental data from server shutdown and inlettemperature ramp tests. The experimentally obtained parameters are implemented into a computational fluid dynamics (CFD) case study of server shutdown in which the transient server exit air temperature is computed from the lumpedcapacitance parameters via a userdefined function. The results thus obtained are in excellent agreement with the experimental data.
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      Determination of the Lumped Capacitance Parameters of Air Cooled Servers Through Air Temperature Measurements

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    http://yetl.yabesh.ir/yetl1/handle/yetl/154476
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    contributor authorSalih Erden, Hamza
    contributor authorEzzat Khalifa, H.
    contributor authorSchmidt, Roger R.
    date accessioned2017-05-09T01:06:49Z
    date available2017-05-09T01:06:49Z
    date issued2014
    identifier issn1528-9044
    identifier otherep_136_03_031005.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/154476
    description abstractComputer servers can be represented by lumped thermal capacitances for the purpose of simulating server and data center transient thermal response to changes in operating conditions or equipment failures. Two parameters are needed to characterize the transient behavior of a lumpedcapacitance server: its thermal capacitance and its thermal conductance, heat transfer effectiveness, or time constant. To avoid the laborious task of obtaining these parameters from measurements or estimations of the thermal characteristics of internal components of the server, a method is proposed to derive these parameters from external measurements that can be easily obtained without performing an “autopsyâ€‌ on the server. In this paper, we present the mathematical formulation underlying the proposed method and describe how the parameters are to be obtained from external airtemperature measurements using the mathematical model. We then present validation test cases using experimental data from server shutdown and inlettemperature ramp tests. The experimentally obtained parameters are implemented into a computational fluid dynamics (CFD) case study of server shutdown in which the transient server exit air temperature is computed from the lumpedcapacitance parameters via a userdefined function. The results thus obtained are in excellent agreement with the experimental data.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleDetermination of the Lumped Capacitance Parameters of Air Cooled Servers Through Air Temperature Measurements
    typeJournal Paper
    journal volume136
    journal issue3
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.4027092
    journal fristpage31005
    journal lastpage31005
    identifier eissn1043-7398
    treeJournal of Electronic Packaging:;2014:;volume( 136 ):;issue: 003
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian