| contributor author | Salih Erden, Hamza | |
| contributor author | Ezzat Khalifa, H. | |
| contributor author | Schmidt, Roger R. | |
| date accessioned | 2017-05-09T01:06:49Z | |
| date available | 2017-05-09T01:06:49Z | |
| date issued | 2014 | |
| identifier issn | 1528-9044 | |
| identifier other | ep_136_03_031005.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/154476 | |
| description abstract | Computer servers can be represented by lumped thermal capacitances for the purpose of simulating server and data center transient thermal response to changes in operating conditions or equipment failures. Two parameters are needed to characterize the transient behavior of a lumpedcapacitance server: its thermal capacitance and its thermal conductance, heat transfer effectiveness, or time constant. To avoid the laborious task of obtaining these parameters from measurements or estimations of the thermal characteristics of internal components of the server, a method is proposed to derive these parameters from external measurements that can be easily obtained without performing an “autopsy†on the server. In this paper, we present the mathematical formulation underlying the proposed method and describe how the parameters are to be obtained from external airtemperature measurements using the mathematical model. We then present validation test cases using experimental data from server shutdown and inlettemperature ramp tests. The experimentally obtained parameters are implemented into a computational fluid dynamics (CFD) case study of server shutdown in which the transient server exit air temperature is computed from the lumpedcapacitance parameters via a userdefined function. The results thus obtained are in excellent agreement with the experimental data. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Determination of the Lumped Capacitance Parameters of Air Cooled Servers Through Air Temperature Measurements | |
| type | Journal Paper | |
| journal volume | 136 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.4027092 | |
| journal fristpage | 31005 | |
| journal lastpage | 31005 | |
| identifier eissn | 1043-7398 | |
| tree | Journal of Electronic Packaging:;2014:;volume( 136 ):;issue: 003 | |
| contenttype | Fulltext | |