| contributor author | Mahan, Kenny | |
| contributor author | Sun, Yong | |
| contributor author | Han, Bongtae | |
| contributor author | Han, Sungwon | |
| contributor author | Osterman, Mike | |
| date accessioned | 2017-05-09T01:06:49Z | |
| date available | 2017-05-09T01:06:49Z | |
| date issued | 2014 | |
| identifier issn | 1528-9044 | |
| identifier other | ep_136_03_031004.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/154475 | |
| description abstract | Reliability of conformal coatings used to mitigate tin whisker growth depends on their ability to contain tin whiskers. Two key material properties required to assess the reliability of a polyurethane coating are documented experimentally: adhesion strength and puncture strength. A modified blister test using a predefined blister area is employed to assess the adhesion strength and a puncture test is employed to evaluate the puncture strength of the coating. After measuring the properties at time zero, the coatings are subjected to accelerated testing conditions (high temperature/humidity storage and temperature cycling) and the degradations of the coating properties are documented. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Adhesion and Puncture Strength of Polyurethane Coating Used to Mitigate Tin Whisker Growth | |
| type | Journal Paper | |
| journal volume | 136 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.4026922 | |
| journal fristpage | 31004 | |
| journal lastpage | 31004 | |
| identifier eissn | 1043-7398 | |
| tree | Journal of Electronic Packaging:;2014:;volume( 136 ):;issue: 003 | |
| contenttype | Fulltext | |